Chip packaging structure with electromagnetic shielding function and packaging method

Abstract

The invention provides a chip packaging method with an electromagnetic shielding function, and the method comprises the following steps: preparing a cooling fin with an insulating projection, and bonding a metal pin on the insulating projection; bonding a chip module on one surface of the radiating fin, which is provided with the insulating bulge; the pins of the chip module are electrically connected with the metal pins on the insulating protrusions through wire harnesses; and welding a shielding shell at one end, far away from the radiating fin, of the insulating bulge, and carrying out plastic packaging on the shielding shell and the radiating fin to obtain a chip finished product. In the chip manufacturing process, the production and preparation technology is improved, so that the chip can have an electromagnetic shielding function, the product performance is further improved, and the situation that equipment cannot work normally or breaks down due to the fact that the chip is prone to being interfered by electromagnetic interference in the working process is reduced.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and packaging method with electromagnetic shielding function. Background technique [0002] With the popularization of electronic equipment, the demand for chips used to realize circuit control or specific functions has increased significantly; the production volume has also increased, but the product performance is uneven; for example, the existing chips are used in the actual use process. It does not have the electromagnetic shielding function, so that the chip is very prone to failure and the electronic equipment cannot work normally; therefore, there is a lack of a chip packaging process that can have the electromagnetic shielding function. SUMMARY OF THE INVENTION [0003] The invention provides a chip packaging structure and packaging method with electromagnetic shielding function, which are used to improve the production and preparation ...

AI Technical Summary

Problems solved by technology

[0002] With the popularization of electronic equipment, the demand for chips used to realize circuit control or specific functions has increased significantly; production has also increased, but product performance is uneven; Among them, there is no electromagnetic shielding function, which makes the chip very prone to failure and the electronic equipment cannot work normally; therefore, there is a lack of a chip packaging process with electromagnetic shielding function

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