Structure of impedance signal line of TO-can semiconductor package
A semiconductor and packaging technology, applied in the field of impedance signal line structure, can solve the problems of bandwidth degradation, insignificant improvement, and poor signal transmission.
Pending Publication Date: 2022-06-03
OPTOELECTRONICS SOLUTIONS
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Problems solved by technology
Therefore, the signal line 20 is generally used as an inductor and the inductance increases as the frequency becomes higher, thus causing a problem that the signal from the head part cannot be well transmitted to the semiconductor laser or other parts on the ceramic board
Although the impedance is improved due to filling the dielectric and solder between the signal lines, the effect of the improvement is not significant
Also, the bandwidth is more degraded than with only the header and no additional signal lines
Method used
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[0033] Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
[0034] However, the technical idea of the present disclosure is not limited to some embodiments set forth herein, but may be embodied in various different forms, and may be selectively combined among the embodiments without departing from the scope of the present disclosure and one or more of the replacement elements.
[0035] Also, unless explicitly defined and described otherwise, terms (including technical and scientific terms) used in the embodiments of the present disclosure may be construed as meanings that can be commonly understood by one of ordinary skill in the art to which the present disclosure belongs and the related art may be considered Contextual meaning to explain commonly used terms, such as those defined in dictionaries.
[0036] Also, the terms used in the embodiments of the present disclosure are used for the purpose of describin...
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Abstract
A structure of an impedance signal line of a TO-can type semiconductor package according to an embodiment is disclosed. A transistor profile (TO)-can type semiconductor package includes: a head including a semiconductor laser diode disposed on one side of the head; a signal line penetrating the head and including one end protruding from one side of the head; and an edge coupled microstrip (ECM) portion connected to the signal lines, the ECM portion including a dielectric and ECM lines, the ECM lines being formed as conductive patterns having a predetermined width on a first side of the dielectric with a predetermined pitch therebetween, and being respectively connected to the signal lines.
Description
technical field [0001] Embodiments relate to a structure of an impedance signal line of a transistor outline (TO)-can type semiconductor package. Background technique [0002] With the recent expansion and widespread use of optical devices, the demand for data transmission using optical fibers in various networks such as local area networks (LANs) has rapidly increased. In particular, research related to high-speed data transmission has been actively conducted, and thus various packaged type semiconductor laser diodes have been released. [0003] 1A to 1C is a diagram showing a signal line structure of a conventional TO-can type module package, and Figure 2A and 2B is a graph showing the results of simulating the RF characteristics of a conventional signal line structure. [0004] refer to Figures 1A to 1C , the structure includes a header 10 with a specific impedance and a signal line 20 running through the feedthrough. The through signal lines 20 include single or ...
Claims
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IPC IPC(8): H01S5/02345H01S5/0239
CPCH01S5/02345H01S5/0239H01S5/02212H01S5/06226H01L23/528H01L23/525H01L23/647
Inventor 朴文秀高永信
Owner OPTOELECTRONICS SOLUTIONS