Wafer processing cleaning fluid, production method and equipment
A technology for producing equipment and cleaning solutions, applied in chemical instruments and methods, preparation of detergent mixture compositions, detergent compounding agents, etc.
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[0025] In this embodiment, the heat conduction column 18 and the heat dissipation plate 19 are uniformly made of copper-aluminum alloy, and have good heat conduction and heat dissipation performance. The heat conduction column 18 absorbs the heat of the mixed liquid and transfers it to the heat dissipation plate 19 Contact with the outside air to dissipate heat, the setting of the heat dissipation fins 20 increases the area of the heat dissipation plate 19, improves the heat dissipation efficiency of the heat dissipation plate 19, and the first dustproof net 21 prevents the fan 14 from dissipating the heat from the air. The dust inhaled by the air outlet plate 16 into the box 11 is discharged through the cooling holes on the top of the box 11 itself, and the second dust-proof net 22 is set to prevent dust from entering through the cooling holes. The tank 11 affects the quality of the cleaning fluid.
[0026]Further, the preparation tank 1 includes a tank body 3, an agitator ...
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