Mini/microLED bonding pad intelligent cleaning device

A cleaning device and intelligent technology, applied in cleaning methods and utensils, cleaning methods using tools, chemical instruments and methods, etc., can solve the problems of re-dropping of residues, excessive solder paste, secondary pollution of residues, etc. Conducive to recycling, subsequent installation, and the effect of preventing secondary pollution

Active Publication Date: 2022-07-05
安徽大学绿色产业创新研究院 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention can solve the problem that when the existing equipment cleans the pads, there are often more solder paste residues on the pads, which cannot effectively clean the pads. Accurate cleaning of the residue on the pad will affect the follow-up installation effect of the

Method used

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  • Mini/microLED bonding pad intelligent cleaning device
  • Mini/microLED bonding pad intelligent cleaning device
  • Mini/microLED bonding pad intelligent cleaning device

Examples

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Example Embodiment

[0037] Embodiments of the present invention are described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways as defined and covered by the claims.

[0038] like Figure 1 to Figure 10 As shown, an intelligent cleaning device for Mini / microLED pads includes: a mounting plate 1, the mounting plate 1 has a rectangular structure, a mounting frame 11 is symmetrically installed on the rear side of the mounting plate 1, and the cross-section of the mounting frame 11 is an L-shaped structure, and the installation Mounting slots are evenly provided on the rack 11 , and the mounting rack 11 is installed through the mounting slots.

[0039] Cleaning component 2, the cleaning component 2 is mounted on the front end surface of the mounting board 1, and the cleaning component 2 is used to clean the residue on the pad to prevent the damaged LED from remaining on the pad.

[0040] Injection valve 3, the injection v...

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Abstract

The invention relates to a Mini/microLED bonding pad intelligent cleaning device which comprises a mounting plate, a cleaning assembly, an injection valve and a vibration assembly, the cleaning assembly is mounted on the front end face of the mounting plate and used for cleaning residues on a bonding pad, the injection valve is mounted on the left side of the front end of the mounting plate, and the vibration assembly is mounted on the lower side of the front end face of the mounting plate and used for cleaning residues on the bonding pad. The front end of the mounting plate drives the cleaning assembly to perform vibration cleaning on the bonding pad. The device can solve the problems that when an existing device cleans a bonding pad, many solder paste residues often exist on the bonding pad, the residues on the bonding pad cannot be effectively and accurately cleaned, the follow-up installation effect of an LED is affected, and meanwhile when the existing device cleans the bonding pad, the residues cannot be effectively and accurately collected, and the service life of the LED is prolonged. And the residues are easy to fall again, so that secondary pollution of the residues is caused, and subsequent installation of the LED is not facilitated.

Description

technical field [0001] The invention relates to the technical field of Mini / microLED production, in particular to an intelligent cleaning device for Mini / microLED pads. Background technique [0002] Mini / microLED is a new generation of display technology with self-luminous display characteristics. Compared with the existing organic light emitting diode technology, Mini / microLED display device has the advantages of higher brightness, better luminous efficiency and lower power consumption. When the LED is damaged, the damaged LED needs to be replaced. After the LED is removed, there will often be solder paste residue on the surface of the pad, so it is necessary to clean up the residue on the pad in time to prevent the replacement of new ones. LED lighting failure occurs. [0003] At present, the existing equipment usually has the following defects when cleaning the pads: 1. When the existing equipment cleans the pads, there are often more solder paste residues on the pads, w...

Claims

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Application Information

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IPC IPC(8): B08B1/00B08B13/00
CPCB08B1/006B08B1/007B08B13/00
Inventor 郭庆川侯玉强周立辉郭滢滢王文会
Owner 安徽大学绿色产业创新研究院
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