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Circuit board and preparation method thereof

A technology of circuit boards and board parts, which is applied in the field of circuit board manufacturing, can solve the problems of low production yield of circuit boards, achieve the effect of avoiding lamp beads or pad areas, improving production yield, and ensuring accuracy

Active Publication Date: 2022-07-05
CAMELOT QINGYUAN HYTEC TECH INVESTMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the production yield of circuit boards for traditional LED products is low, especially for circuit boards with high-density miniature pads

Method used

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  • Circuit board and preparation method thereof

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Embodiment Construction

[0035] In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

[0036] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only ...

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Abstract

The invention provides a circuit board and a preparation method thereof. The preparation method of the circuit board comprises the following steps: providing a board; the plate is baked at a preset temperature, so that the plate surface copper thickness of the plate reaches a first preset thickness, and the hole copper thickness of the plate reaches a second preset thickness; detecting the expansion and shrinkage coefficient of the plate to obtain an actual expansion and shrinkage coefficient; judging whether the actual expansion coefficient is smaller than or equal to an expansion coefficient threshold value or not; if yes, screen printing operation is carried out on the plate, so that an ink layer is formed on the surface of the plate; and exposing and developing the plate, so that only when the actual expansion coefficient of the baked plate is smaller than or equal to the expansion coefficient threshold value, ink screen printing operation is carried out, the precision of ink screen printing of the plate is ensured, namely, the precision of solder resist windowing, lamp bead windowing and other parts is ensured, and ink is prevented from being formed in a lamp bead or bonding pad area. And the preparation yield of the circuit board is improved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a circuit board and a preparation method thereof. Background technique [0002] Mini LED technology, also known as sub-millimeter light-emitting diode, refers to changing the dozens of LED lamp beads in the side backlight of traditional LCD display to thousands, tens of thousands or even more direct-lit backlight lamp beads. Through the dense distribution of a large number of lamp beads, regional dimming in a small range is realized, so that higher brightness uniformity and color contrast can be achieved in a smaller light mixing distance, which can improve the backlight performance of existing LCD display devices. It has greatly improved the performance of ultra-thin, high color rendering and power saving of end products. [0003] In order to adapt to the market development of LED circuit boards, the circuit boards used in Mini LED backlight products also need to deve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/28
CPCH05K3/0011H05K3/022H05K3/287Y02P70/50
Inventor 叶志荣金辉堂黄永健
Owner CAMELOT QINGYUAN HYTEC TECH INVESTMENT