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Semiconductor MEMS packaging structure and method

A packaging structure and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device parts, microstructure technology, etc., can solve problems such as poor chip working effect, achieve good working environment temperature, good cooling effect, and avoid heat generation hot effect

Active Publication Date: 2022-07-08
盐城芯丰微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the process of packaging MEMS chips, they will be exposed to high-temperature environments many times, such as chip mounting, housing mounting, etc.; For heat dissipation, it is only a simple opening process, which leads to poor working effect of the chip

Method used

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  • Semiconductor MEMS packaging structure and method
  • Semiconductor MEMS packaging structure and method
  • Semiconductor MEMS packaging structure and method

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Embodiment Construction

[0036] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments, so that those skilled in the art can implement the invention with reference to the description.

[0037] It should be understood that terms such as "having", "comprising" and "including" as used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0038] like Figure 1-Figure 11 As shown, the present invention provides a semiconductor MEMS package structure, including: a package structure body 100 and an anti-drop exhaust assembly 4, the package structure body 100 includes a substrate 101, a sensor group, and a cap body 104, the sensor group The cap body 104 is arranged on the substrate 101 and covered on the sensor group. The cap body 104 is provided with an exhaust hole, and the anti-fall exhaust The assembly 4 is disposed on the base plate 101 , and the cap body 104 is located in the anti-fall e...

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Abstract

A semiconductor MEMS packaging structure disclosed by the present invention comprises a packaging structure main body and an anti-drop exhaust assembly, the packaging structure main body comprises a substrate, a sensor group and a sealing cap body, the sensor group is arranged on the substrate, the sealing cap body is arranged on the substrate and covers the sensor group, the sealing cap body is provided with an exhaust hole, the anti-drop exhaust assembly is arranged on the substrate, and the anti-drop exhaust assembly is arranged on the substrate. And the cap sealing body is positioned in the anti-drop exhaust assembly. When the semiconductor MEMS packaging structure is used, heat generated by working of the sensor group can be exhausted to the outside through the exhaust hole, and then the heat is further exhausted to the outside in an accelerated manner through the drop-resistant exhaust assembly, so that the semiconductor MEMS packaging structure has a good cooling effect, a good working environment temperature can be kept, and the service life of the semiconductor MEMS packaging structure is prolonged. And the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being influenced by heat and hot. The invention further discloses a packaging method of the semiconductor MEMS packaging structure, and the working efficiency and the life cycle of the semiconductor MEMS packaging structure are prevented from being affected by heat and hot.

Description

technical field [0001] The present invention relates to the technical field of semiconductor packaging, and more particularly, to a semiconductor MEMS packaging structure and method. Background technique [0002] MEMS micro-sensor is a general term for a series of micro-sensors designed, processed and packaged by MEMS technology, including pressure sensors, humidity sensors, temperature sensors, acceleration sensors, etc. The packaging of MEMS microsensors is the last step for MEMS sensors to be accepted by customers and widely used in the market, and it is also a very critical step in the manufacture of MEMS microsensors. At present, during the packaging process of MEMS chips, they will be exposed to high temperature environments for many times, such as chip mounting, shell mounting, etc.; The heat dissipation is only a simple opening treatment, which leads to the poor working effect of the chip. Therefore, it is necessary to propose a semiconductor MEMS packaging method ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81B7/02B81C1/00
CPCB81B7/02B81B7/0093B81C1/00261B81B2201/02
Inventor 周建军陈高利杨晓胜
Owner 盐城芯丰微电子有限公司
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