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Grinding roller for cleaning liquid crystal panel and preparation method of grinding roller

A liquid crystal panel and grinding roller technology, which is applied in the direction of grinding tools, grinding/polishing equipment, grinding devices, etc., can solve the problems of scrap cleaning yield, panel degradation, and large scratch risk, so as to avoid the risk of scratch , reduce production costs, ensure the effect of grinding yield and stability

Pending Publication Date: 2022-07-12
BEIJING GRISH HITECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a grinding roller for cleaning a liquid crystal panel and a preparation method thereof, which is used to solve the problem of a large risk of scratching the panel in the prior art when cleaning the grinding rubber roller and the cleaning brush, etc. Degraded or scrapped or low cleaning yield defects

Method used

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  • Grinding roller for cleaning liquid crystal panel and preparation method of grinding roller
  • Grinding roller for cleaning liquid crystal panel and preparation method of grinding roller

Examples

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preparation example Construction

[0055] The present invention provides a method for preparing a grinding roller for cleaning a liquid crystal panel, based on the grinding roller for cleaning a liquid crystal panel according to any of the above embodiments, comprising:

[0056] The abrasive layer 4 is spirally arranged on the support layer, the abrasive layer 4 is extended along the axial direction of the support layer, and the abrasive layer 4 has a gap in the axial direction of the support layer to form a chip flute.

[0057] In this way, through the grooves and chip removal grooves 5 of the grinding layer 4 of the functional layer, during the grinding and cleaning process of the grinding roller to the workpiece, the grinding dust can be stored in time, and the secondary damage to the grinding workpiece caused by the hard grinding dust can be avoided. , to avoid the risk of scratching; in addition, the helical structure of the chip flute 5 can remove excess wear debris in time, which can ensure continuous gri...

Embodiment 1

[0073] Example 1: Select acrylic resin and polyurethane for compounding in a ratio of 1:2, and mix and disperse uniformly with aluminum hydroxide abrasive by high-speed stirring to obtain a coating slurry, and the particle size of the abrasive is 9 μm; the uniformly dispersed mixed slurry The material is coated on the buffer base material to obtain the abrasive layer 4; the foamed PP wrap is attached to the outer ring surface of the support bearing 1 to prepare an elastic shaft roller; the double-sided foam film with a hardness of 24 degrees Shore hardness and The grinding layer 4 is compounded, and the corresponding width of 20mm is cut out according to the size of the grinding roller, and then the axial angle (the included angle with the axis of the support bearing 1) is 45 degrees and spirally adheres to the elastic shaft roller to ensure chip removal. The width of groove 5 is 5mm; the edge of the grinding roller is trimmed, and the edges and corners of the grinding roller a...

Embodiment 2

[0075] Example 2: Select acrylic resin and polyurethane for compounding according to the ratio of 1:2, and mix and disperse evenly with aluminum hydroxide abrasive by high-speed stirring to obtain a coating slurry, and the particle size of the abrasive is 9 μm; the uniformly dispersed mixed slurry The material is coated on the buffer base material to obtain the abrasive layer 4; the foamed PP wrap is attached to the outer ring surface of the support bearing 1 to prepare an elastic shaft roller; the double-sided foam film with a hardness of 24 degrees Shore hardness and The grinding layer 4 is compounded, and the corresponding width of 20mm is cut according to the size of the grinding roller, and then the axial angle (the included angle with the axis of the support bearing 1) is 10 degrees and spirally adheres to the elastic shaft roller to ensure chip removal. The width of groove 5 is 5mm; the edge of the grinding roller is trimmed, and the edges and corners of the grinding rol...

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Abstract

The invention relates to the technical field of cleaning supplies, and provides a grinding roller for cleaning a liquid crystal panel and a preparation method thereof.The grinding roller comprises a supporting layer and a functional layer, the supporting layer is used for being connected with grinding equipment, the functional layer comprises a grinding layer and a chip groove, the grinding layer is spirally arranged on the supporting layer, and the chip groove is formed in the supporting layer; a plurality of grooves for storing abrasive dust are formed in the grinding layer; the chip grooves are spirally formed in the supporting layer, the chip grooves and the grinding layer are arranged in parallel, and the chip grooves extend in the axial direction of the supporting layer. Through the groove and the chip groove of the grinding layer, in the process that the grinding roller grinds and cleans a workpiece, grinding chips can be stored in time, secondary damage to the ground workpiece caused by hard grinding chips can be avoided, and the scratch risk is avoided; in addition, redundant abrasive dust can be discharged in time through the spiral structure of the chip discharging groove, the continuous grinding yield and stability can be guaranteed, and the cleaning yield is improved.

Description

technical field [0001] The invention relates to the technical field of cleaning products, in particular to a grinding roller used for cleaning liquid crystal panels and a preparation method thereof. Background technique [0002] The manufacturing process of liquid crystal panels can be divided into three stages, including one: the front-end Array process, that is, the semiconductor process, where the thin film layer of the transistor is made on the glass substrate; the second: the middle-stage Cell process, which is the glass and color filter of the thin film layer of the transistor. The glass of the sheet is combined together, and the liquid crystal is poured into the middle; the third: the back-end Module Assembly process, that is, the panel module process, the backlight panel, iron parts and IC parts are assembled on the back of the cell. [0003] Among them, in the front-end Array process, the glass must be cleaned after inputting, gluing and etching, coating and other l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/11B24D18/00
CPCB24B37/11B24D18/0054B24D18/0072
Inventor 盛菲菲刘春雨
Owner BEIJING GRISH HITECH
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