Supporting structure for semiconductor detection

Abstract

The invention discloses a supporting structure for semiconductor detection, and relates to the field of semiconductors, the supporting structure comprises a bottom plate, the top side of the bottom plate is provided with a fixed disc through a plurality of first telescopic rods, the fixed disc is provided with a plurality of sliding holes, the sliding holes are internally provided with elastic jacking units in a sliding mode, the top sides of the elastic jacking units are located on the same plane, and the elastic jacking units are arranged in the sliding holes. And a positioning rod is mounted on the top side of the fixed disc through an adjusting mechanism. The tops of the multiple elastic jacking units are located on the same plane to form a supporting plane used for supporting a semiconductor to be detected, during semiconductor detection, the tip end of the metal rod tightly presses the semiconductor, pressure is transmitted to the sliding column through the supporting column, and a proper elastic force value is set for the elastic units; the sliding column overcomes the elastic force of the elastic unit to slide downwards, so that the distance between the semiconductor and the tip of the metal rod is increased, the pressure of the metal rod on the semiconductor is reduced, and the semiconductor is protected and prevented from being damaged.

Description

technical field [0001] The present invention relates to the field of semiconductors, in particular to a support structure for semiconductor inspection. Background technique [0002] Semiconductor is an indispensable and important part of electronic equipment. During the processing and use, various tests will be carried out to determine whether it is suitable for further device processing, such as square resistance measurement. The general measurement method is to use a pointed metal thin rod. The thin metal rods are pressed on the semiconductor with a certain pressure, so that the four thin metal rods can obtain multiple voltage values ​​to obtain the resistivity of the semiconductor, and then use the resistivity to obtain the square resistance of the semiconductor. [0003] In the prior art, when a thin metal rod is used for square resistance measurement, the distance between the metal rod and each semiconductor varies due to the manufacturing error, installation error and ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of this application is to provide a support structure for semiconductor detection, to solve the problem that the distance between the metal rod and each semiconductor is caused by the manufacturing error of the semiconductor, the installation There are differences due to the influence of many factors such as errors. When the tip of the metal rod is pressed on the semiconductor, the pressure is too small to cause poor contact and inaccurate measurement values. The question of the impact

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