Radiator and communication equipment

A heat sink and heat dissipation structure technology, which is applied in the direction of instrumentation, cooling/ventilation/heating transformation, calculation, etc., can solve the problems of low heat conduction capacity and low heat dissipation reliability of the heat sink

Pending Publication Date: 2022-07-15
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Communication equipment includes heat sinks, which usually require corresponding heat dissipation design for heat sinks. However, traditional heat sinks have low thermal conductivity and low heat dissipation reliability.

Method used

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  • Radiator and communication equipment
  • Radiator and communication equipment
  • Radiator and communication equipment

Examples

Experimental program
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Embodiment Construction

[0115] For the convenience of understanding, the terms involved in the embodiments of the present application will be explained first.

[0116] And / or: It is just an association relationship that describes an associated object, which means that there can be three kinds of relationships, for example, A and / or B, it can mean that A exists alone, A and B exist at the same time, and B exists alone. .

[0117] Plural: means two or more than two.

[0118] Fixed: It should be understood in a broad sense. For example, if A is fixed to B, it can be that A and B are directly connected and the relative position after the connection does not change, or A and B are indirectly connected through an intermediate medium and the relative position after the connection does not change. Variety.

[0119] The specific embodiments of the present application will be clearly described below with reference to the accompanying drawings.

[0120] Embodiments of the present application provide a commun...

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PUM

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Abstract

The invention provides a radiator and communication equipment. Comprising a substrate, a heat dissipation structure and a cooling medium. The heat dissipation structure comprises a connecting part and a tooth part which are of an integrated structure, the connecting part is connected with the substrate, an included angle is formed between the tooth part and the connecting part, the tooth root of the tooth part is connected to the connecting part, the tooth top of the tooth part is far away from the connecting part, a cooling flow channel is formed in the heat dissipation structure, and the cooling flow channel is communicated with the cooling flow channel. The cooling flow channel extends from the connecting part to the tooth part and extends between the tooth root and the tooth top; and the cooling medium flows in the cooling flow channel so as to dissipate heat of the substrate. According to the technical scheme, the heat conduction capacity of the radiator can be improved, and the radiating reliability is good.

Description

technical field [0001] The present application relates to the technical field of heat dissipation, and in particular, to a radiator and a communication device. Background technique [0002] With the development of communication technology, communication equipment is developing in the direction of high speed and high power density, and the heat consumption density of communication hot backup is also getting higher and higher. Heat dissipation has become an important challenge in the design of communication equipment. The heat dissipation directly affects the working reliability and comprehensive performance of communication equipment. Communication equipment includes a radiator, and a corresponding heat dissipation design is usually required for the radiator. However, the traditional heat sink has low thermal conductivity and low heat dissipation reliability. SUMMARY OF THE INVENTION [0003] The embodiments of the present application provide a heat sink and a communicatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20145H05K7/2029H05K7/20309H05K7/20G06F1/20
Inventor 张宇李磊王东王萌
Owner HUAWEI TECH CO LTD
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