Novel wafer defect detection device
A defect detection, wafer technology, applied in the direction of optical defect/defect, sorting, workshop equipment, etc., can solve the problems of affecting production efficiency, wafer secondary pollution, time waiting, etc., to prevent ink from secondary pollution crystal Roundness, shortening of drying time, and improvement of production efficiency
Pending Publication Date: 2022-07-22
无锡光诺自动化科技有限公司
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Problems solved by technology
At present, the detection of wafer scratches or stains generally uses manual identification, which is inefficient and easy to miss. At the same time, when marking the wafers, putting the ink into the wafer box before the ink is dry will cause secondary pollution of the wafers. Marking ink is dry, which will cause time waiting and affect production efficiency
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[0031] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.
[0032] Unless expressly stated otherwise, throughout the specification and claims, the term "comprising" or its conjugations such as "comprising" or "comprising" and the like will be understood to include the stated elements or components, and Other elements or other components are not excluded.
[0033] like figure 1 , figure 2As shown, a new type of wafer defect detection device includes a base 1 and a material rack 3 sequentially arranged on the base 1, a reclaiming device, a wafer rotation positioning device, a wafer rack moving device 13, a wafer turning device, a wafer turning device, and a wafer turning device. A circular defect detection device, a spotting device, a drying device and a discharging device; a wafer rack 20 is arranged on the wafer rack moving...
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The invention relates to a novel wafer defect detection device. The novel wafer defect detection device comprises a base, and a feeding frame, a material taking device, a wafer rotating and positioning device, a wafer frame moving device, a wafer overturning device, a wafer defect detection device, a dotting device, a drying device and a discharging device which are sequentially arranged on the base, a wafer rack is arranged on the wafer rack moving device, and a wafer is placed on the wafer rack. The wafer double-sided defect detection device has the advantages that double-sided defects of the wafer can be conveniently detected, the detected defects can be dotted and marked, dotted marks can be dried, secondary pollution of ink marks to the wafer is prevented, and the production efficiency is improved.
Description
Technical field: [0001] The present invention relates to the field of chip technology, in particular to a novel wafer defect detection device. Background technique: [0002] During the manufacturing process of wafers, scratches often occur on the surface, and there will be surface stains during the production process. Such wafers with surface scratches or surface stains will be scratched or stained when they are subsequently sliced into chips. The quality of the chip is generally poor. In order to avoid this bad phenomenon, the wafer should be inspected before slicing, and the defective wafer should be removed, or the defective part of the wafer should be marked. When slicing, the marked wafer should be removed. , to avoid poor quality of sliced chips. At present, the detection of wafer scratches or stains generally adopts manual identification, which is inefficient and easy to miss. At the same time, when the wafer is marked and the ink is not dry, it will cause second...
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Login to View More IPC IPC(8): B07C5/34B07C5/02B07C5/36B07C5/38G01N21/95H01L21/67B25H7/04
CPCB07C5/34B07C5/02B07C5/361B07C5/362B07C5/38G01N21/9501H01L21/67034H01L21/67271B25H7/04
Inventor 韩志刚陈伟
Owner 无锡光诺自动化科技有限公司