Substrate manufacturing and shaping method and substrate

Abstract

The invention provides a substrate and a substrate manufacturing and shaping method, and relates to the technical field of metal material performance analysis and structure processing, and the substrate manufacturing and shaping method comprises the following steps: a manufacturing step: manufacturing a substrate for shaping; in the bending step, the substrate is subjected to isothermal bending, a bending angle alpha is obtained, and the bending radius R0 is corrected in the following mode: k is a correction coefficient, h is the distance between the highest point and the lowest point when the substrate is bent to the maximum degree, A is the distance between the left end and the right end when the substrate is bent to the maximum degree, and S is the thickness of the substrate; according to the method, the sheet is subjected to bending treatment by utilizing an isothermal bending forming technology, and relative error calculation is performed on different isothermal temperatures, so that the purpose of fitting the measured curved surface is achieved, the method has a good research prospect in isothermal forming substrate preparation, the bending radius is corrected, and the measurement accuracy is improved. And the relative error of the shape of the shaped substrate is reduced, so that the effects of stable measurement and high sensitivity are realized.

Description

technical field [0001] The invention belongs to the technical field of metal material performance analysis and structure processing, and particularly relates to a substrate manufacturing and shaping method and a substrate. Background technique [0002] Sensors face many technical challenges, one of which is packaging. Due to the differences in the physical properties of the substrates and the different sticking positions, the strains obtained after different encapsulations are inconsistent with the true strain values ​​of the tested structures. In addition, different objects to be tested have different structures and surface properties, therefore, the encapsulation of the fixture must also be adjusted according to the actual situation. For the structure to be measured with a curved surface, the use of common plastic and rubber substrates will cause deviations in the measurement results, affect the sensitivity of the measurement, and cannot meet the needs of use. SUMMARY O...

AI Technical Summary

Problems solved by technology

For the structure to be tested with a curved surface, the use of common plastic and rubber substrates will cause deviations in the measurement results, affect the sensitivity of the measurement, and cannot meet the needs of use

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