Optical detection equipment

Abstract

The invention provides optical detection equipment which is used for detecting surface defects of a wafer. The optical detection equipment comprises a support assembly, a carrying table, a first main detection lens, a second main detection lens, a carrying table driving unit and an imaging analysis unit, the camera shooting end of the first main detection lens faces the camera shooting end of the second main detection lens, and the camera shooting end of the first main detection lens and the camera shooting end of the second main detection lens are arranged in the direction perpendicular to the supporting face of the carrying table. The supporting surface of the carrying table is provided with a light-transmitting structure; when the carrying table driving unit drives the carrying table to move in the x direction and / or the y direction of the plane where the supporting face of the carrying table is located, the carrying table bearing the to-be-detected wafer is located between the first main detection lens and the second main detection lens which are correspondingly arranged so that the front face and the back face of the to-be-detected wafer can be detected at the same time. And the front surface detection result and the back surface detection result of the wafer to be detected completely correspond to each other, so that the purposes of simplifying the detection process and improving the defect detection rate and the detection efficiency of the wafer are achieved.

Description

technical field [0001] The invention belongs to the technical field of wafer detection, and in particular relates to an optical detection device. Background technique [0002] Wafer refers to the wafer used to make silicon semiconductor circuits, and its starting material is usually silicon. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, which are then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished and sliced ​​to form a silicon wafer, that is, a wafer. In the wafer fabrication process, a series of processes such as pulling a single crystal, slicing, grinding, polishing, build-up, photolithography, doping, heat treatment and scribing can cause defects on the wafer surface. In order to prevent defective wafers from flowing into the packaging process, optical inspection equipment is needed to identify and classify and mark defects on the wafer surface to assist in wafer sorting. [0003] The e...

AI Technical Summary

Problems solved by technology

[0003] Existing optical inspection equipment can only inspect one side of the wafer, and cannot realize simultaneous inspection on both sides; when both sides of the wafer need to be inspected, the wafer needs to be transferred or even turned over. action, resulting in cumbersome detection process and low detection efficiency

In addition, the existing optical inspection equipment is prone to the situation that the detection results of the front side of the wafer and the detection results of the back side of the wafer are difficult to correspond to each other after inspection, which affects the detection rate of wafer defects.

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