Laser carrier and manufacturing method thereof
A manufacturing method and laser technology, which can be used in lasers, laser parts, semiconductor lasers, etc., can solve the problems of large space occupied by lasers and complex processes.
Pending Publication Date: 2022-07-26
HUAWEI TECH CO LTD
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Problems solved by technology
[0006] The embodiment of the present application provides a laser carrier and its manufacturing method, which solves the problems that the laser takes up a large space and the process is complicated
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[0033] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.
[0034] Hereinafter, the terms "first", "second", etc. are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", etc., may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.
[0035] In addition, in this application, orientation terms such as "upper" and "lower" are defined relative to the orientation in which the components in the drawings are schematically placed. It should be understood that these directional terms are relative concepts, and they are used for relative In the description and cla...
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The embodiment of the invention discloses a laser carrier and a manufacturing method thereof, the laser carrier is used for bearing a laser chip, the first surface of the laser carrier is provided with a first conductive layer, the first conductive layer is electrically connected with a first signal line; the first conducting layer is electrically connected with a first signal line, the second conducting layer is electrically connected with a second signal line, the second conducting layer and the first conducting layer are arranged at an interval, the laser chip is arranged on the first conducting layer, and the laser chip is electrically connected with the second conducting layer; and the thin-film resistor is formed on the first surface of the laser carrier, and the thin-film resistor is electrically connected with the laser chip through the first conductive layer or the second conductive layer. Therefore, impedance matching of the laser is achieved by directly forming the thin-film resistor on the laser carrier, meanwhile, the thin-film resistor is small in occupied space, the integration degree is increased, the process is simple, and large-scale production is facilitated.
Description
technical field [0001] The embodiments of the present application relate to the field of semiconductors, and in particular, to a laser carrier and a manufacturing method thereof. Background technique [0002] At present, with the continuous emergence of technologies such as 5G mobile communication, virtual reality and cloud computing, people's demand for communication bandwidth is exploding. [0003] At the optical transmitter end, the electrical signal and the DC bias signal can be directly loaded onto the laser after being mixed by a driver or other means, and the output optical power of the laser can be changed by changing the input current of the laser. Among them, in order to make the bandwidth of the laser-based transmitting module as high as possible, it is necessary to match the impedance of the laser chip when packaging the laser chip. [0004] For example, the commonly used transmission line impedance is 50Ω, while the impedance of the laser chip is generally arou...
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Patent Timeline
Login to View More IPC IPC(8): H01S5/023H01S5/02325H01S5/0233H01S5/02345
CPCH01S5/02325H01S5/0233H01S5/02345H01S5/023H01S5/022
Inventor 邓磊宋海平张伟伟王天祥李旭
Owner HUAWEI TECH CO LTD