Illuminating system suitable for proximity contact type automatic exposure machine

Abstract

The invention discloses an illumination system suitable for a proximity contact type automatic exposure machine, which comprises a lens, the inner side wall of the lens is provided with a semi-transparent and semi-reflective mirror, the upper surface of the lens is provided with a CCD camera, the outer side wall of the lens is provided with a coaxial illumination lamp, and the coaxial illumination lamp is provided with a camera. An adjusting cylinder is slidably connected to the outer side wall of the lens and located below the coaxial illuminating lamp, and the lower surface of the adjusting cylinder is in threaded connection with an annular illuminating lamp. The influence caused by coating glass powder on the surface of the wafer and acid spots on the surface can be reduced, meanwhile, the shadow area formed by projection of the mask plate on the wafer is reduced, the imaging effect is greatly improved, and automatic alignment is better facilitated.

Description

technical field [0001] The invention relates to the technical field of proximity contact type automatic exposure machines, in particular to an illumination system suitable for proximity contact type automatic exposure machines. Background technique [0002] In the field of proximity contact automatic exposure machines, it is not only necessary to capture the marks on the mask before the alignment movement, but also to capture the wafer marks hidden by the mask through the mask, and whether a clear and accurate image can be captured. It has a great impact on whether the subsequent alignment can be completed and whether the expected alignment accuracy can be achieved; [0003] In actual production, the imaging effect of the wafer in the imaging system is often inconsistent due to different processes, which leads to the situation that the marks on the wafer cannot be found or misjudged in the automatic alignment. Using a single light source to capture images has great limitati...

AI Technical Summary

Problems solved by technology

[0003] In actual production, the imaging effect of the wafer in the image system is often inconsistent due to different processes, resulting in the automatic alignment not being able to find the mark on the wafer or misjudgment. When traditional equipment is aligned, only Using a single light source to capture images has relatively large limitations. When the surface of the wafer is coated with glass powder or has acid spots on the surface, it will seriously affect the automatic alignment. Therefore, a method suitable for close contact is proposed. Illumination system of automatic exposure machine

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