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Conveying chamber and manufacturing equipment with same

A transfer chamber and sensor technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as wafer damage, and achieve the effect of improving work efficiency and accelerating cooling

Pending Publication Date: 2022-07-29
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present disclosure is to provide a transfer chamber and its manufacturing equipment to solve the problem in the prior art that the method of manually adjusting the position of the wafer in the transfer chamber easily damages the wafer

Method used

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  • Conveying chamber and manufacturing equipment with same
  • Conveying chamber and manufacturing equipment with same
  • Conveying chamber and manufacturing equipment with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] see attached Figure 4 , in the transfer chamber of this embodiment, the gas pipeline of the air supply device is located above the tray assembly 1, and the air supply device has one gas pipeline, and the gas blown from the gas pipeline reaches the tray assembly 1 from top to bottom, and then The wafer 10 is protected. In this way, the space in the transmission room is more concise and does not take up too much space. The flow direction of the gas is shown by the arrow in the figure.

[0091] When the door of the transfer chamber is opened, the sensor detects the opening of the door, the sensor is connected to the controller in communication, the controller controls the gas pipeline of the air supply device to open, and the gas blown from the gas pipeline reaches the tray assembly 1 from top to bottom. At this time, the operator adjusts the position of the wafer 10 to protect the wafer during the transfer process.

Embodiment 2

[0093] see attached Figure 5 , in the transfer chamber of this embodiment, the gas pipeline of the air supply device is located above the tray assembly 1, and the air supply device has a plurality of gas pipelines, and the gas blown from the gas pipeline reaches the tray assembly 1 from top to bottom, and then The wafer 10 is protected. In this way, the airflow is made more uniform, and the flow area of ​​the airflow can be increased, thereby achieving a better protection effect. The flow direction of the gas is shown by the arrow in the figure.

[0094] When the door of the transfer chamber is opened, the sensor detects the opening of the door, the sensor is connected to the controller in communication, the controller controls the gas pipeline of the air supply device to open, and the gas blown from the gas pipeline reaches the tray assembly 1 from top to bottom. At this time, the operator adjusts the position of the wafer 10 to protect the wafer during the transfer proces...

Embodiment 3

[0096] see attached Image 6 , in the transfer chamber of this embodiment, the gas pipelines of the air supply device are provided above and below the tray assembly 1, the gas blown from the upper gas pipeline reaches the tray assembly 1 from top to bottom, and the gas pipeline below The blown gas reaches the tray assembly 1 from bottom to top, thereby protecting the wafer 10 . In this way, the effect of convection can be achieved, so that the wafers 10 on each tray can be protected, so as to achieve a better protection effect. The flow direction of the gas is shown by the arrow in the figure.

[0097] In some embodiments, when the door of the transfer chamber is opened, the sensor detects the opening of the door, the sensor is connected in communication with the controller, and the controller controls the opening of the gas pipeline of the gas supply device, and the gas blown from the upper gas pipeline is It reaches the tray assembly 1 from top to bottom, and the gas blown...

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PUM

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Abstract

The invention provides a transfer chamber and manufacturing equipment with the same, the transfer chamber is used for transferring wafers, the transfer chamber comprises an accommodating cavity and a door body, the door body is movably arranged at an opening of the accommodating cavity to open or close the accommodating cavity; the tray assembly is arranged in the containing cavity, the tray assembly comprises a plurality of trays which are arranged in a stacked mode, and the tray assembly is used for bearing wafers; and the gas supply device is arranged on one side, far away from the tray assembly, of the wafer so as to blow gas to the wafer on the tray assembly. The transfer chamber disclosed by the invention solves the problem that the wafer is easily damaged by a method for manually adjusting the position of the wafer in the transfer chamber in the prior art.

Description

technical field [0001] The present disclosure relates to the field of semiconductor storage, and in particular, to a transfer chamber and a manufacturing apparatus having the same. Background technique [0002] The equipment used in semiconductor wafer processing is complex and includes many different systems. The transfer chamber is particularly important as a transfer station for wafers entering and leaving the reaction chamber. The transfer chamber generally includes several main parts such as wafer angle alignment devices, cooling devices, and robotic arms. The wafer is made by the robot arm to grab the wafer on the aligner for angle alignment. After the wafer is made, the robot arm puts the wafer on the cooling station to cool and then grabs it back to the wafer transfer tray. [0003] However, a problem that often occurs at present is that the position of the wafer on the cooling station is deviated or the robot alarms, which can cause the robot to not grasp the wafer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67196H01L21/67109
Inventor 唐辉
Owner CHANGXIN MEMORY TECH INC