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Wafer conveying device, wafer pre-pumping device and rapid wafer conveying system

A transfer device and wafer technology, applied to conveyor objects, transportation and packaging, electrical components, etc., can solve the problems of low efficiency, long transfer time, and low production capacity, so as to reduce the transfer time and improve Stability, speed-up effects

Pending Publication Date: 2022-07-29
DONGFANG JINGYUAN ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The present invention provides a wafer transfer device, a wafer pre-extraction device, and a fast transfer system to solve the technical problems of long transfer time, low transfer efficiency, and low productivity in the wafer transfer process in the prior art

Method used

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  • Wafer conveying device, wafer pre-pumping device and rapid wafer conveying system
  • Wafer conveying device, wafer pre-pumping device and rapid wafer conveying system
  • Wafer conveying device, wafer pre-pumping device and rapid wafer conveying system

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Embodiment Construction

[0072] In order to make the above and other features and advantages of the present invention more apparent, the present invention is further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explaining to those skilled in the art, and are merely illustrative and not restrictive.

[0073] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientations or positional relationships indicated by "radial direction", "circumferential direction", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rathe...

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PUM

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Abstract

The invention provides a wafer conveying device which comprises a base and a wafer supporting component fixed on the base, a plurality of supporting assemblies are formed on the inner side face of the wafer supporting component, clamping grooves are formed between the supporting assemblies, and the supporting assemblies are arranged at intervals in the direction perpendicular to the base; moreover, the inner side surface of the wafer supporting part forms an arc matched with the outer peripheral edge of the wafer, so that the wafer is stably arranged at intervals in the wafer conveying device in the direction perpendicular to the base. The wafer conveying time is shortened, the service life of a sealing ring of the wafer pre-pumping device is prolonged, the amount of particles substituted into the main detection module is reduced, and the service life of a pump for pumping air for the wafer pre-pumping device is prolonged.

Description

technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a wafer transfer device, a wafer pre-pumping device and a rapid wafer transfer system. Background technique [0002] In the process of chip production, wafer inspection is a crucial link. When inspecting wafers, a wafer transfer system is required to transfer the wafers to the inspection station of the wafer inspection equipment. , also known as the transfer process. [0003] like figure 1 Shown is a schematic diagram of the bottom surface structure of a wafer transfer device in the prior art, figure 2 Shown is a schematic diagram of a wafer placed on the bottom surface of a wafer transfer device in the prior art. The wafer transfer device in the prior art has a very flat circular bottom surface, and four brackets are provided on the circular bottom surface, and the wafers are placed on the brackets. [0004] In the traditional wafer transfer system, the singl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/67H01L21/673
CPCH01L21/67313H01L21/67766H01L21/67781H01L21/67265
Inventor 张刚
Owner DONGFANG JINGYUAN ELECTRON LTD
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