Isothermal device based on three-dimensional heat pipe network

Abstract

According to the isothermal device based on the three-dimensional heat pipe network, the traditional restriction that high-heat-consumption equipment needs to be directly installed on a heat dissipation face is eliminated, and overall layout is facilitated; the heat consumption containing level of the non-heat-dissipation surface of the spacecraft can be improved, and the overall heat dissipation capacity of the spacecraft is improved. The isothermal device comprises a heat pipe network A, a heat pipe network B, a heat pipe network C and a three-dimensional heat pipe network, the two mutually communicated heat pipes pre-buried in the structural plate A form a heat pipe network A; a heat pipe network B is formed by more than two heat pipes which are pre-embedded in the structural plate B and are communicated with each other; a heat pipe network C is formed by more than two heat pipes which are pre-embedded in the structural plate C and are communicated with each other; the structural plate A, the structural plate B and the structural plate C are distributed in a three-dimensional manner, are independent from one another and are not connected with one another; and one of the structural plate A, the structural plate B and the structural plate C is a non-radiating surface structural plate. And the three-dimensional heat pipe network is used for communicating the heat pipe network A, the heat pipe network B and the heat pipe network C.

Description

technical field [0001] The invention relates to an isothermalization device, in particular to an isothermalization device based on a three-dimensional heat pipe network, and belongs to the technical field of spacecraft thermal control. Background technique [0002] For high-power spacecraft, the traditional thermal control solution is to directly install high-heat-consuming equipment on the heat-dissipating surface. Due to the envelope size of the spacecraft, the installation size of the heat-dissipating surface is relatively limited, and some high-heat-consuming equipment cannot be installed on the heat-dissipating surface. The deck where the surface is located has a high layout restriction and is difficult to dissipate heat. SUMMARY OF THE INVENTION [0003] In view of this, the present invention provides an isothermalization device based on a three-dimensional heat pipe network, which relieves the traditional restriction that high heat consumption equipment needs to be ...

AI Technical Summary

Problems solved by technology

[0002] For high-power spacecraft, the traditional thermal control solution is to install high-heat-consuming devices directly on the heat-dissipating surface. Due to the envelope size of the spacecraft, the installable size of the heat-dissipating surface is relatively limited, and some high-heat-consuming devices cannot be installed on the cooling surface. The deck where the surface is located has high layout restrictions and difficulties in heat dissipation

Images