Methods, systems, and structures for filling recesses on substrate surface

Abstract

Methods and systems for forming structures and structures formed using the methods or systems are disclosed. An exemplary method includes depositing a material on a surface of a substrate, and processing the deposited material to form a processed material. These methods may be used to fill recesses on a substrate surface.

Description

technical field [0001] The present disclosure generally relates to methods of forming structures suitable for use in electronic device fabrication. More particularly, examples of the present disclosure relate to methods of forming structures including layers of deposited material that can be used to fill recesses on the surfaces of the structures, structures including such layers, and systems for performing the methods and / or forming the structures. Background technique [0002] During the fabrication of devices, such as semiconductor devices, it is often desirable to fill features or recesses (eg, trenches or gaps) on the surface of a substrate with insulating or dielectric materials. Some techniques for filling recesses include depositing a layer of flowable material, such as flowable carbon material. [0003] While filling features with flowable carbon material may work well for some applications, filling features with conventional deposition techniques of flowable carbo...

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Problems solved by technology

[0003] Although filling features with flowable carbon material can work well for some applications, filling features with traditional deposition techniques of flowable carbon has several disadvantages, especially as the size of the recess to be filled decreases

For example, flowable carbon films may not exhibit desirable thermal stability (e.g., no shrinkage), density, hardness, modulus, and / or etch selectivity relative to other materials

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