Efficient silicon wafer spin coater based on Bernoulli principle

Abstract

The efficient silicon wafer spin coater based on the Bernoulli principle comprises a rack, a conveying belt and a feeding mechanism, the conveying belt, the feeding mechanism and a storage hopper are installed at the top of the rack, a top cover is installed in the middle of the conveying belt, a glue tank is installed at the top of the top cover, a mounting plate is installed in the top cover, and a glue tank is installed in the mounting plate. A first one-way valve is mounted on the bottom side of the glue tank, a spraying seat is mounted on the bottom side of the mounting plate, the first one-way valve is connected with the top end of a connecting pipe in a communicating manner, and the bottom end of the connecting pipe is connected with the spraying seat in a communicating manner; the motor works to drive the threaded rod to rotate and drive the sliding base in threaded connection to move, the first air pressure rod drives the lifting base and the vacuum suction cup to ascend and descend, silicon wafers are adsorbed and transferred through the vacuum suction cup, automatic feeding of the silicon wafers is achieved, and the machining efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer processing, in particular to a high-efficiency silicon wafer gluing machine based on the Bernoulli principle. Background technique [0002] The glue coating treatment of silicon wafer is to coat the surface of silicon wafer with a thin and uniform glue. [0003] When the existing silicon wafer gluer is actually used, manual feeding operation is required, resulting in low work efficiency; at the same time, during the glue dispensing operation, it is impossible to adjust the lifting position of the silicon wafer to realize automatic filling of glue and The automatic mixing of glue in the glue tank needs to be specially equipped with a liquid pump and a motor. SUMMARY OF THE INVENTION [0004] The problem solved by the invention is to provide a high-efficiency silicon wafer gluer based on the Bernoulli principle, which solves the problem that the existing silicon wafer gluer needs manual fee...

AI Technical Summary

Problems solved by technology

[0004] The problem solved by the present invention is to provide a high-efficiency silicon wafer homogenizer based on Bernoulli's principle, which solves the problem that the existing silicon wafer homogenizer needs to be manually loaded during actual use, resulting in low work efficiency; at the same time During the glue dispensing operation, it is impossible to adjust the lifting position of the silicon wafer to realize the automatic filling of glue and the automatic stirring of glue in the glue tank. It is necessary to be specially equipped with a liquid pump and a technical problem to realize the motor.

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