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Improved conductive polymer device and method for manufacturing same

A technology of conductive polymer layer and manufacturing method, applied in the field of surface-mounted shapes, conductive polymer PTC materials, and conductive polymer PTC devices, which can solve the problems of circuit protection devices being impractical, unrealized, and difficult to manufacture

Inactive Publication Date: 2005-04-27
BOURNS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Fabrication of useful devices with bulk resistivities below approximately 0.2 Ω-cm has not yet been achieved
First, there are inherent difficulties in the fabrication process when dealing with such low bulk resistivities
Second, a device with such a low bulk resistivity would not have a large PTC effect, making it very impractical as a circuit protection device
Thus, there is an inherent limit on the maximum holding current value that can be obtained for any given footprint of the device

Method used

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  • Improved conductive polymer device and method for manufacturing same
  • Improved conductive polymer device and method for manufacturing same
  • Improved conductive polymer device and method for manufacturing same

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Embodiment Construction

[0095] Referring now to the accompanying drawings, figure 1 A first laminated substructure or foil 10 and a second laminated substructure or foil 12 are illustrated. According to the invention, providing the first and second foils 10, 12 is the first step in the process of manufacturing a conductive polymer PTC device. The first laminate foil 10 comprises a first conductive polymer PTC material layer 14 sandwiched between first and second metal layers 16A, 16B. In a subsequent step of the process, a second or intermediate conductive polymer PTC material layer 18 is provided for lamination between the first foil 10 and the second foil 12, as described below. The second foil 12 comprises a third layer 20 of conductive polymer PTC material sandwiched between third and fourth metal layers 16C, 16D. The conductive polymer PTC layers 14, 18, 20 can be made of any suitable conductive polymer PTC composition, such as high density polyethylene (HDPE) mixed with an amount of carbon bl...

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Abstract

An electronic device has three conductive polymer layers sandwiched between two external electrodes and two internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal. The device is manufactured by: (1) providing (a) a first laminated substructure comprising a first polymer layer between first and second metal layers, (b) a second polymer layer, and (c) a second laminated substructure comprising a third polymer layer between third and fourth metal layers; (2) isolating selected areas of the second and third metal layers to form, respectively, first and second arrays of internal metal strips; (3) laminating the first and second laminated substructures to opposite surfaces of the second conductive polymer layer to form a laminated structure; (4) isolating selected areas of the first and fourth metal layers to form, respectively, first and second arrays of external metal strips; (5) forming insulation areas on the exterior surfaces of the external metal strips; and (6) forming a plurality of first terminals, each electrically connecting a metal strip in the first internal array to a metal strip in the second external array, and a plurality of second terminals, each electrically connecting a metal strip in the first external array to a metal strip in the second internal array; and (7) singulating the laminated structure into a plurality of devices, each having three polymer layers connected in parallel between first and second terminals.

Description

[0001] Cross References to Related Applications [0002] This application is a continuation-in-part of pending application No. 09 / 035,196 filed March 5,1998. Background technique [0003] The present invention relates generally to the field of conducting polymer positive temperature coefficient (PTC) devices, and more particularly to conducting polymer PTC devices of layered structure, having more than one layer of conducting polymer PTC material, especially formed into a shape suitable for surface mounting. [0004] Electronic devices containing elements made of conductive polymers have become increasingly common in various applications, for example, they are widely used in overcurrent protection and self-controlled heater devices, where the polymer materials used have a positive Temperature Coefficient. Examples of positive temperature coefficient (PTC) polymeric materials and examples of devices incorporating these materials are disclosed in the following U.S. patents: ...

Claims

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Application Information

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IPC IPC(8): H01C1/14H01C7/02
CPCH01C7/021H01C7/027H01C7/02
Inventor 安德鲁·布瑞安·巴莱特史蒂文·D·霍格黎文彬杨昆明
Owner BOURNS INC