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Wafer preparation systems and methods for preparing wafers and wafer washing and drying equipment

A technology for preparing systems and wafers, which is applied in transportation and packaging, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problems of occupying cleaning room space, achieve the requirements of reducing pollutants, minimizing floor space, and multi-flexibility Effect

Inactive Publication Date: 2005-06-08
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the system is more efficient in cleaning wafers in the vertical direction, it will take up a lot of space in the cleaning room
In addition, the above setup must use robotic arms to handle the wafer at every stage of the process

Method used

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  • Wafer preparation systems and methods for preparing wafers and wafer washing and drying equipment
  • Wafer preparation systems and methods for preparing wafers and wafer washing and drying equipment
  • Wafer preparation systems and methods for preparing wafers and wafer washing and drying equipment

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Embodiment Construction

[0027] Inventions for wafer preparation equipment, namely washing, rinsing, etching, rinsing and drying, are disclosed. In a preferred embodiment, the wafer preparation system includes a wafer washing unit and a drying unit. The wafer cleaning unit is used to receive a wafer and transfer the wafer internally to the drying unit. In a preferred embodiment, the drying unit is arranged above the wafer washing unit. In the following detailed description, numerous specific details are set forth in order to provide a complete explanation of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some or all of the same specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0028] FIG. 1A shows a wafer washing and drying unit arranged in a vertical direction according to a preferred embodiment of the...

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PUM

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Abstract

Wafer preparation systems and methods for wafer preparation are provided. The wafer preparation system includes a washing unit and a drying unit vertically arranged above the washing unit. The cleaning unit receives a wafer for mechanical scrubbing, and the drying unit receives the wafer from the cleaning unit after mechanical scrubbing. Cleaning and drying are done with the wafers in a homeotropic orientation. An edge support connected to a lift bar lifts the wafers through the washing unit to the drying unit. The wafer preparation method includes receiving a wafer in a washer and lifting the wafer from inside the washer to a dryer arranged vertically above the washer.

Description

technical field [0001] The invention relates to a semiconductor wafer preparation system and a wafer preparation method, in particular to a system for effectively using space and processes to clean and dry semiconductor wafers. Background technique [0002] During the manufacturing process of semiconductor devices, chemical mechanical polishing (CMP) operations and wafer cleaning steps must be performed. Integrated circuit devices are typically multilayer structures. A transistor device having a diffusion region is formed in the substrate layer. In the next few layers, interconnect metal lines are patterned and electrically connected to the transistor devices to define the intended functional devices. It is well known to insulate patterned conductive layers from other conductive layers using dielectric materials, such as silicon dioxide. As more metal layers and associated dielectric layers are formed, the need to planarize the dielectric material increases. Without plan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/677H01L21/304
CPCH01L21/67028Y10S438/906H01L21/304
Inventor 大卫·T·弗罗斯特奥利弗·戴维·琼斯
Owner LAM RES CORP