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Production method of radiating plate with grounded reference potential function for radiating type chip plastic package

A technology of reference potential and plastic packaging, which is applied in the direction of circuits, electrical components, electric solid devices, etc., and can solve the problems of electrical disconnection, difficult heat dissipation plate grounding reference potential, etc.

Inactive Publication Date: 2005-07-06
PHOENIX PRECISION TECH CORP
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  • Summary
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Problems solved by technology

However, in the most common open-down chip carrier, the adhesive layer between the substrate and the heat sink is usually insulating, so that there is no electrical connection between the substrate and the heat sink, and it is difficult to use the heat sink as a ground reference potential a part of

Method used

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  • Production method of radiating plate with grounded reference potential function for radiating type chip plastic package
  • Production method of radiating plate with grounded reference potential function for radiating type chip plastic package
  • Production method of radiating plate with grounded reference potential function for radiating type chip plastic package

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with specific embodiments and accompanying drawings. Of course, the present invention can be implemented in many different ways, and is not limited to the content described in this specification.

[0018] The invention relates to a manufacturing method of a cooling plate with the function of grounding reference potential for heat dissipation chip plastic packaging. The cooling plate can not only provide better heat dissipation effect, but also have the function of grounding reference potential. However, it is worth pointing out that the drawings of the present invention are only for reference and illustration, and are not drawn according to actual size, that is, they do not reflect the actual size and characteristics of each layer in the chip carrier structure.

[0019] see figure 2 , which is the first preferred embodiment of the present invention. First, a plastic circuit substrate 1 (or...

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Abstract

A method for of cooling chip plastic package with earth reference potential function cooling plate not only increasing heat radiativity of the plastic packaging base plate but also being used as the earth reference potential, including an adhesive thin plate and a conductive adhesive subject adhering a base plate a cooling plate, the said adhesive thin plate is composed of single layer of multilayer and the said conductive ahessive subject is an organism filled with conductive fillers, the said plate has an open-end containing chips and a conduction layer as the earth line and its surface contacting with the conductive subject and the cooling plate at the same time.

Description

technical field [0001] The present invention relates to a kind of heat dissipation plate with grounding reference potential function and is used for the manufacturing method of heat dissipation type chip plastic packaging, which includes single crystal (singh-chip) or polycrystal (multi chip) packaging, especially relates to the manufacture of heat dissipation type integrated A heat dissipation plate mounting method for circuit chip packaging, wherein the heat dissipation plate also has the function of grounding reference potential. Background technique [0002] As the semiconductor industry continues to advance, electronic systems and electronic packages are often designed to use the smallest possible space that is practical. The space carrying the circuit is a valuable asset and should be utilized as much as possible. Miniaturizing the circuit is an effective way to make good use of the space, and the miniaturized circuit can also increase the operating speed, reduce noise...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/98
CPCH01L2224/48091H01L2224/48227H01L2224/49109
Inventor 董一中杨正雄许诗滨
Owner PHOENIX PRECISION TECH CORP
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