Method for eliminating electromagnetic interference by impedance match of electronic wire

A technology of impedance matching and electromagnetic interference, which is used in circuits, electrical components, communication cables, etc.

Inactive Publication Date: 2005-07-13
MITAC INT CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on solving the defects of the prior art described above, the present invention provides a method for solving electromagnetic interference by using impedance matching of electronic wires, and the main purpose of the present invention is to solve the problem of electronic wire matching in a variety of different ways, and It can further reduce the phenomenon of electromagnetic interference. On the one hand, it can make the transmission signal inside the wire less susceptible to interference and attenuation; on the other hand, it can also reduce the leakage of electromagnetic waves to the outside of the wire to form electromagnetic interference.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for eliminating electromagnetic interference by impedance match of electronic wire
  • Method for eliminating electromagnetic interference by impedance match of electronic wire
  • Method for eliminating electromagnetic interference by impedance match of electronic wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The detailed structure of the present invention and its connections will be described below in conjunction with the accompanying drawings, so as to facilitate your examiners' further understanding of the present invention. The present invention is mainly applied to the differential signal wires of electronic products, and the applicable interfaces of the differential signal wires are: Universal Serial Bus (USB), IEEE 1394 or liquid crystal display (LCD) and motherboard in notebook computers (Notebook) Connected cables... and other occasions where high-speed signal transmission is required, so that electronic data can be transmitted quickly and error-free.

[0028] Please refer to figure 1 , the graph shows the first embodiment of the present invention to maintain a constant value of impedance to reduce electromagnetic interference, wherein the electronic wire 1 is composed of symmetrical double wires, and the composition of the electronic wire 1 is a differential signal...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention is a method for solving electromagnetic interference by using the impedance matching of electronic wires. In this method, the electronic wires are processed by the following methods: using laser or ultrasonic waves for hot melting, hot melting or gluing, and connecting data lines with data lines. ; or the data wire and the ground wire are kept equidistant, and the braided mesh or metal foil covered by the data wire directly connects it to the circuit board of the electronic product, or it is used as a ground wire, so that the inside of the wire will not be damaged during data transmission. Due to the impedance mismatch, the radiation phenomenon of the mismatched signal energy leaks to the outside of the wire, thereby forming electromagnetic interference. The several methods listed in the present invention are to solve the phenomenon of electromagnetic waves leaking from the wire, so that electronic products It can meet the range of electromagnetic standards when tested.

Description

technical field [0001] The invention relates to a method for solving electromagnetic interference by using impedance matching of electronic wires, especially a method for transmitting signal energy caused by signal reflection of wires used in electronic products (such as: USB interface, IEEE 1394) when transmitting data Leaking out of the wire leads to the problem of electromagnetic interference, and the present invention is just a variety of methods proposed to solve this problem. Background technique [0002] So far, the computer and electronics industry has become the main industry of our country. As far as the current situation is concerned, the manufacturing technology of my country's electronics industry has reached a world-class level, making my country the largest exporter of computers and electronic products, and also laying a foundation for my country's computer industry. And the technical foundation of the electronics industry. After the tec...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01B11/00H01B13/00H01B13/22
Inventor 李秉峰
Owner MITAC INT CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products