Chip of ink-jet head

Abstract

A chip of ink jet head is composed of a substrate, a heat barrier layer, which is a resistance-type polycrystalline silicon layer on the substrate and is divided into the electric resistor area of heating plate and the electrically conductive area formed by doping, and a protecting layer on said polycrystalline layer.

Description

technical field [0001] The invention relates to an inkjet head chip. Background technique [0002] In the existing chip structure, the large-scale integrated circuit (LSI) manufacturing process shown in Figure 1 is to first coat the silicon substrate of the chip with SiO 2 A layer of thermal barrier film is formed, and then the resistance layer (TaAl) and the conductive layer (Al) are successively plated by sputtering, and the required size is limited by the manufacturing process of yellow light and etching, and then the sputtering device is used to or a chemical vapor deposition (CVD) device coated with a protective layer (Si 3 N 4 / SiC), in this manufacturing method, because the conductive layer and the resistive layer are upper and lower layers, when the size is limited, a slope will be formed due to the erosion effect, so the protective layer will form a step at the junction of the conductive layer and the resistive layer ( Step) phenomenon, such as figure 2 As shown...

AI Technical Summary

Problems solved by technology

[0002] In the existing chip structure, the large-scale integrated circuit (LSI) manufacturing process shown in Figure 1 is to first coat the silicon substrate of the chip with SiO 2 A layer of thermal barrier film is formed, and then the resistance layer (TaAl) and the conductive layer (Al) are successively plated by sputtering, and the required size is limited by the manufacturing process of yellow light and etching, and then the sputtering device is used to or a chemical vapor deposition (CVD) device coated with a protective layer (Si 3 N 4 / SiC), in this manufacturing method, because the conductive layer and the resistive layer are upper and lower layers, when the size is limited, a slope will be formed due to the erosion effect, so the protective layer will form a step at the junction of the conductive layer and the resistive layer ( Step) phenomenon, such as figure 2 Shown in the middle circle; this kind of step phenomenon is likely to cause stress concentration, poor step coverage (Step Coverage) or loose structure when the subsequent protective layer is formed

And the same situation is also arranged in the making of the ink-jet head chip, in the ink-jet head film manufacturing method disclosed in No. image 3 and Figure 4 As shown, it can be seen that there is still a ladder phenomenon between the conductive layers 20, 22 and the resistive layer 34 during the manufacture of the inkjet head chip film; and when the inkjet head is printing, the resistive layer in contact with the heating plate needs to withstand high current, In the environment of high temperature, mechanical shock and chemical corrosion, under this condition, the protective layer is very easy to produce cracks or holes in the step part, and then cause rupture, so that the ink in the box penetrates into the resistive layer and conductive layer of the chip film, causing damage to the components phenomenon occurs

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