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Method for making electronic element with lugs and method for making said electronic element

A technology of electronic parts and bumps, which is applied in the field of manufacturing electronic parts with bumps and manufacturing electronic parts, and can solve problems such as impracticality

Inactive Publication Date: 2005-10-26
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impractical to repeat this step several times in order to obtain solder bumps each with sufficient volume

Method used

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  • Method for making electronic element with lugs and method for making said electronic element
  • Method for making electronic element with lugs and method for making said electronic element
  • Method for making electronic element with lugs and method for making said electronic element

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Embodiment Construction

[0060] A method of manufacturing an electronic part with bumps and another method of manufacturing an electronic part in which an electronic part with bumps is connected to another electronic part such as a substrate will be described below with reference to the accompanying drawings. film etc.

[0061] figure 1 The steps of forming the adhesive film 3 according to the first embodiment of the present invention are shown. FIG. 2 shows the steps of forming bumps 19 . One wafer 1 is transferred from the wafer pad forming step S11 to the adhesive film forming step S17. Between steps S11 and S17, the wafer will undergo: an ashing treatment step 12 before plating, which is used to remove organic substances; a grease removal step S13 for removing grease; a cleaning step S14; and a pickling step S15 for pickling the wafer. In the adhesive film forming step S17, the adhesive film 3 is formed on each connection pad 2 provided on the wafer 1 which is an electronic part (processed thr...

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PUM

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Abstract

Forming solder bumps each having a constant height by surely supplying onto each of electrode pads a solder ball corresponding to a predetermined volume while omitting Au plating performed on the electrode pads onto which the solder bumps are to be formed. For achieving the forming of the solder bumps, the adhesive film is formed instead of the Au plating, the adhesive film being used as an oxidation-preventing film and as film for temporarily fixing each of the solder balls, the solder balls being supplied by stencil mask or the vacuum adsorbing mask.

Description

technical field [0001] The present invention relates to a method of manufacturing electronic parts with bumps, such as mounting substrates, semiconductor components, semiconductor wafers, semiconductor chips, etc., in which a plurality of conductive bumps for electrical connection are formed , and the present invention relates to another method of manufacturing an electronic part in which a first electronic part having bumps is bonded to a second electronic part such as a substrate. Background technique [0002] In recent years, in order to achieve high-density design of circuits and high-speed design of signal transmission in circuits, a connection system that uses bumps to connect printed circuit boards to semiconductor components has been adopted. [0003] A known conventional technique is Japanese Patent Application JP-A-9-199506 (conventional technique 1). Specifically, in Conventional Technique 1, the disclosed method comprises the steps of: forming a nickel film on e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K3/06B23K35/14H01L21/60H05K3/28H05K3/34
CPCH01L2924/01015H01L2924/01082H05K2203/0557H01L2924/01004H01L2224/16H01L2924/01029H01L2224/13099H01L2924/01027H01L24/11H05K3/282H01L2924/01013H01L2924/014H05K2203/124H05K2203/043B23K2201/42H01L2924/01047H01L2224/11334H01L2924/01079H05K2203/041H01L24/16B23K3/0623H05K3/3478H01L2924/01033H01L2924/01005H01L2924/01006H01L2924/01078H01L24/12H01L2224/05001H01L2224/81011H01L2224/1181H01L2224/81024H01L2224/8191B23K2101/42H01L24/13H01L24/03H01L24/05H05K3/20
Inventor 铃木高道山口欣秀大录范行井上康介
Owner HITACHI LTD