Process for making mask type read-only memory
A technology of read-only memory and manufacturing method, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the increase of the resistance value of the buried bit line, avoid short channel effect, and avoid the increase of resistance value Effect
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[0024] The invention provides a method for manufacturing a mask type read-only memory. Figure 1A to Figure 1D Shown is a cross-sectional view of the manufacturing process of a mask-type ROM according to a preferred embodiment of the present invention.
[0025] First, please refer to Figure 1A , providing a substrate 100, such as a semiconductor silicon substrate. Next, a doped conductor layer 102 is formed on the substrate 100 . The material of the doped conductive layer 102 is, for example, polysilicon doped with ions. The method of forming the doped conductive layer 102 is, for example, to form a layer of doped polysilicon on the substrate 100 by doping ions on site by chemical vapor deposition. layer. The doped ions are, for example, phosphorus ions, and the doped dose is, for example, 0.5*10 19 to 0.5*10 21 cm -3 about. Doped ions can also use arsenic ions, and the doped dose is, for example, 0.5*10 19 to 0.5*10 21 cm -3 about. Then, a patterned mask layer 104 ...
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