The application provides an
insulated gate bipolar transistor and a preparation method thereof. The preparation method comprises the following steps: providing a
semiconductor layer comprising a substrate, a
cell region, a transition region and a terminal region; performing
ion implantation of a second conductive type in the
cell region to form a first
body region; forming a plurality of interval arranged groove structures in the
cell region; forming a shielding layer on the upper surface of the
semiconductor layer to
expose the
cell region, and forming an emitter region and a second
body region based on the shielding layer, the bottom surface of the second
body region is below the first body region, the upper surface of the second body region is in the first body region, the first body region and the second body region form a body region, and rapid annealing is performed on the second body region and the emitter region. The body region is formed by twice
ion implantation of low energy and
high energy, so that the concentration peak of the
doping particles is located in the body region, the
threshold voltage consistency of the device is ensured, rapid annealing is performed on the second body region and the emitter region, and the influence of thermal stress on the device is reduced.