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Welding tool, welding bench, front end of welding tool and bench part of welding bench

A welding tool, front-end technology, used in electrical components, circuits, semiconductor/solid-state device manufacturing, etc.

Inactive Publication Date: 2006-02-22
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In response to these recent diversifications, the original products can no longer cope

Method used

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  • Welding tool, welding bench, front end of welding tool and bench part of welding bench
  • Welding tool, welding bench, front end of welding tool and bench part of welding bench
  • Welding tool, welding bench, front end of welding tool and bench part of welding bench

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] First, a SiC block of 36mm x 36mm x 11mm is machined figure 1 In the shape shown, the bottom surface of the base part is 35 mm x 35 mm, the width of the protruding part is 5.4 mm x 30.4 mm, the height is 6 mm, and the front end part has an overall height of 10 mm. Drill three vacuum suction holes with a diameter of 0.5 mm and a depth of 0.5 mm from the tool surface side of the protrusion in a cavity with a diameter of 6 mm and a depth of 0.5 mm, and from the bottom surface side with a diameter of 1.8 mm and a depth of 7 mm. Through hole. Vacuum absorbs semiconductors, etc., and solders while moving. The edge of the tool face is machined with a width of 0.2 mm and an angle of 45 degrees to each edge, and the effective size of the protrusion is processed to be 5 mm×30 mm.

[0065]As a filament, polycrystalline diamond with a thickness of 50 micrometers was coated on the tool surface of the above-mentioned tip portion by a known CVD method using a tungsten wire with a d...

Embodiment 2

[0083] Machined from a 32mm x 12mm SiC block image 3 The lower surface of the base of the shape shown is a platform with a diameter of 31 mm, a protrusion width of 5.4 mm x 30.4 mm, a height of 6 mm, and an overall height of 110 mm. Drill three vacuum suction holes with a diameter of 0.5 mm and a depth of 0.5 mm from the tool surface side of the protrusion in a cavity with a diameter of 6 mm and a depth of 0.5 mm, and from the bottom surface side with a diameter of 1.8 mm and a depth of 7 mm. Through hole. Vacuum absorbs semiconductors, etc., and solders while moving. The edge of the tool face is machined with a width of 0.2 mm and an angle of 45 degrees to each edge, and the effective size of the protrusion is processed to be 5 mm×30 mm.

[0084] As the filament, polycrystalline diamond with a thickness of 50 micrometers was coated on the protrusion made of SiC by a known CVD method using a tungsten wire with a diameter of 0.5 mm and a length of 100 mm. Coverage condition...

Embodiment 3

[0103] The relationship between temperature and flatness was investigated using the welding tool of the present invention produced in Example 1 and the welding tool of Comparative Example. Install it separately in figure 2 On the shank shown, the surface temperature of the tool face and the flatness of the tool face at that temperature were measured by heating with the cartridge heater. The result is as Figure 7 shown. The measurement of the flatness is described in JP-A-5-326642. A gold wire or the like is pressed on the tool face of the bonding tool, and the flatness of the transferred gold wire is measured as the flatness of the tool face.

[0104] The measurement results of the original welding type are indicated by Δ, and the measurement results of the present invention are indicated by black circles. Such as Figure 7 As shown, in the case of the present invention, there is almost no change in the range from 100°C to 550°C. In view of this, the original product i...

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Abstract

The present invention provides a bonding toll and a boding stage that have an exchangeable head. The boding toll or bonding stage for mounting semiconductor is composed of the head and a shank part or a pedestal part. The bonding tool is characterized in that a rectangle or circular substrate part to configure the head and a protrusion that protrudes from the substrate part are constructed from one material, the top of the protrusion is coated with vapor-phase synthetic diamond, and the substrate part and the shank part are mechanically fixed or fixed by vacuum suction to each other.

Description

technical field [0001] The present invention relates to the structure of a soldering tool and / or a soldering station used when semiconductor components such as ICs and LSIs are mounted. Background technique [0002] In order to draw out the electrical characteristics of the semiconductor element, it is necessary to electrically connect the electrodes formed on the semiconductor element to the leads of the components, and external terminals such as the leads and the wiring board. The electrodes on the side of the semiconductor element and the lead wires are bonded one by one using thin metal wires made of gold or copper as wires, using a tool called a capillary, or using a soldering tool heated to a predetermined temperature. And the soldering station, the lead wire called carrier film that is tin-plated on the patterned copper foil, and the method called TAB method (with automatic sticking) that connects all the lead wires to all electrodes on the semiconductor element at a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
Inventor 坂田直纪前村功一郎河内宏矢敷哲男高桥利也尾原利昭
Owner SUMITOMO ELECTRIC IND LTD