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Method of manufacturing semiconductor device and electronic device

A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of semiconductor package self-alignment obstruction, deterioration of semiconductor package configuration accuracy, etc.

Inactive Publication Date: 2006-11-22
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that the self-alignment of the semiconductor package is hindered due to the surface tension at the time of solder ball melting, and the arrangement accuracy of the semiconductor package is deteriorated.

Method used

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  • Method of manufacturing semiconductor device and electronic device
  • Method of manufacturing semiconductor device and electronic device
  • Method of manufacturing semiconductor device and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Hereinafter, a semiconductor device according to an embodiment of the present invention and a method for manufacturing the same will be described with reference to the accompanying drawings.

[0037] figure 1 It is a cross-sectional view showing a schematic configuration of the semiconductor device according to the first embodiment of the present invention. figure 1 Among them, a carrier substrate 1 is provided on the semiconductor package PK1, and lands 2a and 2b are formed on both sides of the carrier substrate 1, respectively. In addition, a semiconductor chip 3 is flip-chip mounted on the carrier substrate 1 , and protruding electrodes 4 for flip-chip mounting are provided on the semiconductor chip 3 . In addition, the protruding electrodes 4 provided on the semiconductor chip 3 are interposed on the land 2b by an ACF (anisotropic conductive film) interposed therebetween.

[0038] On the other hand, a carrier substrate 11 is provided on the semiconductor package P...

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PUM

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Abstract

PROBLEM TO BE SOLVED: To adjust the arranging position of resin between semiconductor packages easily without causing any deterioration in the arrangement precision of the semiconductor packages. SOLUTION: Before semiconductor packages PK1 and PK2 are connected electrically through bump electrodes 13, resin 15 is placed on a semiconductor chip 3 such that at least a part of the semiconductor chip 3 is exposed, and then the semiconductor packages PK1 and PK2 are connected electrically through bump electrodes 13 while sustaining the resin 15 arranged on the semiconductor chip 3 in the state of stage A or stage B.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor device and a method of manufacturing an electronic device, and is particularly suitable for a method of manufacturing a laminated structure of a semiconductor package. Background technique [0002] In a conventional semiconductor package, as disclosed in, for example, Patent Document 1, space saving is achieved by stacking the semiconductor packages with solder balls interposed therebetween. Here, resin is filled between the stacked semiconductor packages. [0003] [Patent Document 1] [0004] Japanese Patent Laid-Open No. 2002-170906 [0005] However, in the conventional semiconductor package, the entire space between the semiconductor packages stacked with solder balls interposed therebetween is filled with resin. Therefore, when the resin filled between the semiconductor packages is cured, the moisture contained in the resin cannot be sufficiently removed, and the moisture...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L23/28H01L25/10H01L23/12H01L21/58H01L21/60H01L21/98H01L25/065H01L25/07H01L25/11H01L25/18H03H9/05
CPCH03H9/0547H01L24/32H01L24/73H01L25/0652H01L25/0657H01L25/105H01L25/50H01L2224/16225H01L2224/32145H01L2224/32225H01L2224/48225H01L2224/48227H01L2224/73204H01L2224/73253H01L2224/73265H01L2225/06562H01L2225/06568H01L2924/01005H01L2924/01006H01L2924/01013H01L2924/01029H01L2924/01033H01L2924/0105H01L2924/01074H01L2924/01075H01L2924/01079H01L2924/15311H01L2924/15331H01L2924/181
Inventor 青栁哲理
Owner SEIKO EPSON CORP