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Lighographic apparatus, alignment method and device mfg method

A technology of photolithography and projection device, which can be used in the manufacture of semiconductor/solid-state devices, the use of optical devices, and exposure devices for photolithography, which can solve problems such as accumulation of measurement errors.

Inactive Publication Date: 2007-07-04
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, known alignment tools and techniques cannot be used to perform alignment with alignment marks with large vertical offsets and thereby align subsequent processing layers with zero marks etched on the bare substrate, thus A series of alignments must be formed between the alignment marks at an intermediate vertical position
This is a disadvantage because measurement errors accumulate over several alignment steps
An additional problem is the fabrication of micro-electromechanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS), where the thickness of the layers is significantly greater than in semiconductor device fabrication

Method used

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  • Lighographic apparatus, alignment method and device mfg method
  • Lighographic apparatus, alignment method and device mfg method
  • Lighographic apparatus, alignment method and device mfg method

Examples

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Embodiment 1

[0046] Fig. 1 schematically shows a lithographic projection apparatus according to a specific embodiment of the present invention. The unit includes:

[0047] a radiation system Ex, IL for providing a radiation projection beam PB (e.g. UV radiation), comprising in this particular example a radiation source LA;

[0048] A first target table (mask table) MT provided with a mask holder for holding a mask MA (e.g. a reticle) and connected to first positioning means for precisely positioning the mask relative to the object PL ;

[0049] A second target table (substrate table) WT provided with a substrate holder for holding a substrate W (e.g. a resist-coated silicon wafer) and connected to a second positioning device for precise positioning of the substrate relative to the object PL ;

[0050] A projection system ("lens") PL (eg a refractive lens system) is used to image the radiation portion of the mask MA onto a target portion C of the substrate W (eg comprising one or more di...

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PUM

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Abstract

In order to align between layers having a large Z separation, e.g. in the manufacture of MEMS or MOEMS, an alignment system which illuminates reference markers with normally incident radiation is used. The alignment system has an illumination system that is telecentric on the substrate side.

Description

technical field [0001] The invention relates to a lithographic projection apparatus, comprising: [0002] Radiation systems for providing radiation projection beams; [0003] a support structure for supporting patterning means for patterning the projected beam according to a desired pattern; [0004] a substrate table for holding the substrate; [0005] a projection system for projecting a patterned beam onto a target portion of a substrate; [0006] An alignment system for detecting alignment between a reference mark and an alignment mark provided on the substrate, the alignment system including an optical system for irradiating the alignment mark with an alignment beam. Background technique [0007] The term "patterning means" as used herein should be interpreted broadly as a means capable of imparting a patterned cross-section to an incident radiation beam, wherein said pattern corresponds to the pattern to be formed on a target portion of the substrate; herein The te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F9/00G02B13/22H01L21/027G01B11/00
CPCG03F9/7069G03F9/7084G03F9/7076H01L21/027
Inventor K·贝斯特A·弗里茨J·康索利尼H·W·M·范比尔桂成群
Owner ASML NETHERLANDS BV