Tin ball maker by double electrothermal filament smelting and cutting method

A technology of electric heating wire and preparation machine, which is applied in the direction of circuits, electrical components, electric solid devices, etc., and can solve the problems of complex and expensive equipment

Inactive Publication Date: 2007-07-25
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the complex and expensive defects of the existing solder ball manufacturing equipment, a solder ball preparation machine with a simple structure and low price is provided by the double heating wire fusion cutting method

Method used

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  • Tin ball maker by double electrothermal filament smelting and cutting method
  • Tin ball maker by double electrothermal filament smelting and cutting method
  • Tin ball maker by double electrothermal filament smelting and cutting method

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Experimental program
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specific Embodiment approach 1

[0005] Specific Embodiment 1: The present embodiment will be specifically described below with reference to FIG. 6 . This embodiment consists of a wire feeder 1, a wire cutting mechanism 2, the same two heating wires 11, a cover body 7, a platform 4 and an oil box 12. The wire feeding machine 1, the wire cutting mechanism 2, the heating wire 11, and the platform 4 and the oil box 12 are all enclosed in the cover body 7, the wire feeder 1 is arranged on the upper part of the cover body 7, the wire cutting mechanism 2 is arranged under the wire feeder 1, and the wire outlet channel 1-1 of the wire feeder 1 is The projection directly below is located in the middle of the two heating wires 11 arranged in parallel in the horizontal direction, and the two heating wires 11 are respectively fixed on the left translation plate 2-1 and the right translation plate of the wire cutting mechanism 2 that can be closed and separated in the horizontal direction 2-2, the wire cutting mechanism ...

specific Embodiment approach 2

[0006] Specific Embodiment 2: The present embodiment will be specifically described below with reference to FIG. 6 and FIG. 7 . The difference between this embodiment and Embodiment 1 is that the wire cutting mechanism 2 consists of a left translation plate 2-1, a right translation plate 2-2, a left hanger arm 2-3, a right hanger arm 2-4, a left arm Square electromagnet 2-5, right side electromagnet 2-6, trunnion frame 2-7, trunnion 2-8, back-moving spring 2-10 and four thermal insulation columns 2-9 are formed, and trunnion frame 2- The upper end of 7 is fixed on the platform 4, the middle part of the left hanger cantilever 2-3 and the middle part of the right hanger cantilever 2-4 are hinged together through the trunnion 2-8, and the upper end of the left hanger cantilever 2-3 is arranged on the right Next to the iron core of the square electromagnet 2-6, the upper end of the right hanger cantilever 2-4 is arranged next to the iron core of the left side electromagnet 2-5, an...

specific Embodiment approach 3

[0007] Specific Embodiment Three: The present embodiment will be specifically described below with reference to FIG. 8 . The difference between this embodiment and Embodiment 1 is that the wire cutting mechanism 2 consists of a left translation plate 2-1, a right translation plate 2-2, a first light bar 2-20, a second light bar 2-23, Drive motor 2-21, lead screw 2-22 and four heat-insulating insulation columns 2-9 are formed, and the two halves of lead screw 2-22 lengthwise direction have the screw thread of opposite direction respectively, and lead screw 2-22 is arranged on Between the first light rod 2-20 and the second light rod 2-23 and parallel to the first light rod 2-20 and the second light rod 2-23, the first light rod 2-20 is inserted into the left translation plate 2- 1 and one end of the right translation plate 2-2 provide a guide for parallel movement for the two, and the second light rod 2-23 inserts the other end of the left translation plate 2-1 and the right tr...

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Abstract

The invention consists of wire feeding machine, wire cutting machine, two identical heating wires, cover, platform and oil box. The wire feeding machine, wire cutting machine, two heating, platform and oil box are packaged in the case. The wire feeding machine is set at the upper part in the case. The wire cutting machine is set at the lower part in the case. The wire output channel is between the two heating wires. The wire cutting machine is connected with the platform. The oil box is set below two heating wires.

Description

Technical field: [0001] The invention relates to a manufacturing device for solder balls used in an integrated circuit chip surface array packaging method. Background technique: [0002] With the development of electronic equipment toward small size, high reliability and light weight, a large number of high-density devices need to be used. In electronic packaging, ball grid array packaging (BGA), chip scale packaging (CSP), and UBGA are new packaging technologies, all of which belong to area array packaging, which is characterized by making spherical bumps in an array on the entire surface of the substrate as pins. For the production of bumps, a large number of solder balls of different sizes must be used no matter whether they are picked and placed or pasted. At present, all kinds of BGA solder balls are produced by manufacturers in large batches. The factory packaging is hundreds of thousands to millions of grains per bottle. The bottle is filled with nitrogen protection...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L2924/14H01L2224/78H01L24/78H01L2924/01082H01L2924/00014H01L2924/01007H01L2224/48H01L2924/00012
Inventor 孔令超王春青李明雨程刚
Owner HARBIN INST OF TECH
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