A pair of electric connector using resin welding flux on one side
A technology of electrical connectors and resins, applied in the direction of welding/welding connections, connections, electrical components, etc., can solve problems such as poor productivity and rising costs, and achieve higher productivity, lower costs, and fewer management pieces.
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Embodiment 1
[0046] 40% by volume of lead free solder (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd., Su-Cu-Ni-AtW-150) and copper powder (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.) , FCC-SP-77, average particle size 10μm) 15% by volume, gently mixed, put into a kneader (manufactured by Moriyama Manufacturing Co., Ltd., 2-axis pressurization type) set at 220°C, and formed heating retention time , kneading for 20 minutes at a rotation speed of 25 to 50 rpm, and disperse the heat-plasticized solder in the resin in a semi-molten state.
[0047] The kneaded body is granulated by a plunger extrusion granulator (TP60-2 type manufactured by Toshin) at a mold temperature of 200-240°C to make granules. Using the pellets, injection molding was performed in a mold (mold temperature, normal temperature to 150° C.) at a set temperature of 230 to 280° C. in an injection molding machine (manufactured by Kawaguchi Tetsuko Co., Ltd., KS-10B). The metal separation of the obt...
Embodiment 2
[0050] PBT resin (manufactured by polymer plastics) 45% by volume Lead free solder (manufactured by Fukuda Metal Foil Powder Industry, Su-Cu-Ni-AtW-150) 40% by volume and copper powder (manufactured by Fukuda Metal Foil Powder Industry, FCC-SP- 77, average particle diameter 10 μ m) 15 volume % make gently mix, put into the kneader (manufactured by Moriyama Manufacturing Co., Ltd., 2-axis pressurization type) that is set at 220 ℃, form heating retention time, with rotation number 25 ~50rpm Keep the temperature of the kneading body above 235°C and do not raise it. By reducing the number of rotations and performing cooling and other treatments, knead for 20 minutes to make the heat plastic and disperse the solder in the resin in a semi-molten state. . Observe the dispersion of the kneaded body in the solder with an optical microscope, and the solder is uniformly dispersed in the resin with a size of about 5 μm.
Embodiment 3
[0052] 5% by volume of lead free solder (manufactured by Fukuda Metal Foil Powder Industry, Su-Cu-Ni-AtW-150) and copper powder (manufactured by Fukuda Metal Foil Powder Industry Co., Ltd.) , FCC-SP-77, average particle size 10 μ m) 10 volume % is gently mixed, the total of the metal components is set to 65 volume %, and the mixture is put into a kneader set at 220 ° C ( Moriyama Seisakusho, 2-axis pressurized type), set the heating holding time, and knead at a rotation speed of 25 to 50 rpm for 20 minutes to make the heat plastic and disperse the solder in the resin in a semi-molten state.
[0053] The kneaded body was granulated with a plunger extrusion granulator (TP60-2 type manufactured by Toshin) at a mold temperature of 200-240° C. to make granules. Using the pellets, injection molding was performed in a mold (mold temperature, normal temperature; 150° C.) with an injection molding machine (manufactured by Kawaguchi Tetsuko, KS-10B) at a set temperature of 230 to 280° C...
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