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Electroplating process

A plating bath, metal technology, applied in the field of metal plating, impregnated silver metal plating, can solve the problems of unfavorable and affecting important characteristics, and achieve the effect of good surface fixed connection, not easy to peel off or wipe off

Inactive Publication Date: 2003-01-15
SHIPLEY CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these additives can adversely affect other important properties of the deposit, such as adhesion and deposition uniformity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Embodiment 1 (comparative example)

[0062] The pretreatment composition was prepared by combining 100 g / L nitrogen triacetic acid ("NTA") and 0.05 g / L copper nitrate dissolved to volume (1 L) with dehydrated ions. The pH of the pretreatment composition was adjusted to 9.

Embodiment 2

[0064] The procedure of Example 1 was repeated except that 1 g / L of imidazole was added to the composition. The pH was adjusted to 9 again.

Embodiment 3

[0066] Copper panels (2 x 6 inches or 5 x 15 cm) were immersed in a commercially available acid cleaner to remove oxides and organic residues from the copper surface, followed by washing with water. The copper plate was then contacted with a commercially available sulfuric acid / hydrogen peroxide based microetching composition to create optimum copper surface uniformity and structure, followed by a water wash. After contacting with the microetching composition, the copper plate was immersed in the pretreatment composition of Example 1 or 2 for 1 minute at room temperature. After pretreatment, the copper plate was washed with water for 1 minute.

[0067] The silver immersion plating bath was prepared by combining 100 g / L of NTA, water, 6 g / L of pyridinecarboxylic acid, 0.005 g / L of DL-2,6-diaminocaproic acid, and 1 g / L of silver nitrate . The pH of the plating bath was adjusted to 9. The temperature of the coating bath is about 50°C.

[0068] The copper plate to be treated w...

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PUM

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Abstract

The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Description

technical field [0001] The present invention relates to the field of metal plating. In particular, the present invention relates to the field of immersion silver metal plating. Background technique [0002] Dip or displacement plating is an electroless plating method, but is a different category in this field. In immersion plating, deposition is via the displacement of elemental metal from the substrate by metal ions in the plating solution. Electroless plating deposition initially proceeds by autocatalytic reduction of metal ions in solution. Such electroless plating requires the presence of a reducing agent. [0003] Immersion plating does not require the use of an external electric current, but the electrochemical displacement reaction is driven by the position of the substrate metal relative to the electromotive series of the metal to be deposited from solution. Plating occurs when metal ions dissolved in a plating bath are displaced (in contact with the plating bath...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/54C23C18/18C23C18/42H05K3/24
CPCC23C18/1834H05K3/244C23C18/42C23C18/54C23C18/1637
Inventor M·A·热日尼克D·L·雅克
Owner SHIPLEY CO INC
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