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Compound high frequency assembly

A component and high-frequency technology, applied in the field of composite high-frequency components, can solve the problems of miniaturization of difficult communication equipment, increasing the number of components, and miniaturization of difficult wireless circuits.

Inactive Publication Date: 2003-04-23
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, conventional baluns and filters are mounted on different circuit substrates from each other, and this arrangement increases the number of components, thereby hindering cost reduction
This arrangement also makes it difficult not only to miniaturize a radio circuit integrating a balun and a filter, but also to miniaturize a communication device integrating a radio circuit into a cellular phone terminal

Method used

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  • Compound high frequency assembly
  • Compound high frequency assembly
  • Compound high frequency assembly

Examples

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no. 1 example

[0031] figure 1 Composite high-frequency components 1a, 1b and a communication device 4 using these components are shown as the first embodiment of the present invention. The communication device 4 is a cellular phone terminal, which consists of a baseband unit 5, an oscillator 6, a frequency converter 7, a composite high-frequency component 1a, a power amplifier 8, an antenna duplexer 9, an antenna 10, a low-noise amplifier 11, a composite high-frequency component 1b, frequency converter 12 and filter 13.

[0032] The composite high-frequency component 1a includes a filter 3a and a balun 2a, which are integrated with each other to form a laminated component. Similarly, the composite high-frequency component 1b includes a filter 3b and a balun 2b, which are integrated with each other to form a laminated component.

[0033] The baseband unit 5 modulates the baseband signal, outputs the baseband modulated signal at the time of transmission, and demodulates the modulated wave i...

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Abstract

The present invention comprises baluns 2a, 2b which convert balanced line signals and unbalanced line signals mutually, and filters 3a, 3b which are electrically connected to the baluns 2a, 2b and pass or attenuate the predetermined frequency bands. Electrode layers 15a-22a, 25a, 41, 42, 43 which compose the electrode patterns of the baluns 2a, 2b and the filters 3a, 3b, and the dielectric layers 30-39 are integrally stacked.

Description

technical field [0001] The present invention relates to complex high-frequency components used in radio circuits such as cellular phone terminals, and to communication equipment using these components. Background technique [0002] Cellular phone terminals have been drastically reduced in size as their performance has increased. To achieve its miniaturization, individual high-frequency components used in wireless circuits have been miniaturized. [0003] Common high-frequency components used in wireless circuits include baluns. The balun is a device that has the function of converting an unbalanced line signal into a balanced line signal and vice versa. An example of the structure of the balun will be described below. Fig. 13 shows a chip converter as an example of the balun. [0004] The chip converter has a multilayer structure composed of dielectric substrates 54a-54e. Dielectric substrates 54a, 54e have shield electrode layers 56, 70 on one major surface thereof, re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/203
CPCH01P1/20345
Inventor 前川智哉繁村広志中久保英明川原惠美子山田彻
Owner PANASONIC CORP
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