Plasma processing system and method therefor

Abstract

A plasma processing system for processing a substrate which includes a single chamber, substantially azimuthally symmetric plasma processing chamber within which a plasma is both ignited and sustained for the processing. The plasma processing chamber has no separate plasma generation chamber. The plasma processing chamber has an upper end and a lower end. The plasma processing system includes a coupling window disposed at an upper end of the plasma processing chamber and an RF antenna arrangement disposed above a plane defined by the substrate when the substrate is disposed within the plasma processing chamber for the processing. The plasma processing system also includes an electromagnet arrangement disposed above the plane defined by the substrate. The electromagnet arrangement is configured so as to result in a radial variation in the controllable magnetic field within the plasma processing chamber in the region proximate the coupling window and antenna when at least one direct current is supplied to the electromagnet arrangement. The radial variation is effective to affect processing uniformity across the substrate. The plasma processing system additionally includes a dc power supply coupled to the electromagnet arrangement. The dc power supply has a controller to vary a magnitude of at least one direct current, thereby changing the radial variation in the controllable magnetic field within the plasma processing chamber in the region proximate the antenna to improve the processing uniformity across the substrate.

Description

Background of the invention [0001] References to related cases [0002] This application is related to the following currently filed U.S. patent applications: [0003] Patent application No.09 / 439661, titled "IMPROVED PLASMA PROCESSING SYSTEMS AND METHODS THEREFOR", (attorney case number: No.LAM1P122 / P0527); [0004] Patent application No.09 / 470236, titled "PLASMA PROCESSING SYSTEM WITHDYNAMIC GAS DISTRIBUTION CONTROL", (attorney case number: No.LAM1P123 / P0557); [0005] Patent application No.09 / 439671, titled "TEMPERATURE CONTROL SYSTEM FORPLASMA PROCESSING APPARATUS", (attorney case number: No.LAM1P124 / P0558); [0006] Patent application No.09 / 440418, titled "METHOD AND APPARATUS FORPRODUCING UNIFORM RATES", (attorney case number: No.LAM1P125 / P0560); [0007] Patent application No.09 / 440794, titled "MATERIALS AND GAS THEMISTRIES FOR PLASMA PROCESSING SYSTEMS", (attorney case number: No.LAM1P128 / P0561); [0008] Patent application No.09 / 439759, titled "METHOD AND APPARATU...

AI Technical Summary

Problems solved by technology

One of the most important issues for manufacturers is the cost of process equipment ownership, which includes, for example, the cost of acquiring and maintaining the system, the frequency of process chamber cleaning required to maintain acceptable process performance, the life of system components, etc.

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