Package method electronic ship made from wafen

Abstract

The method for packaging electronic chip element made of wafer includes the following steps: 1. making electronic chip elements on the wafer and making them spaced and arranged; 2. in the above-mentioned wafer etching the portion where the electronic chip elements are not formed to obtain slot; 3. utilizing vacuum film-pressing equipment to cover the wafer with etched slot with photo resist film or soaking the whole wafer in the container tank with photoresist, so that the whole wafer is covered with a layer of photoresist; 4. heating wafer and drying the photo resist film or photoresist to make it tightly combined on the wafer; and 5. finally, separating out the electronic chip elements from the wafer so as to obtain the packaged electric chip element unit.

Description

Technical field [0001] The invention relates to a packaging method, in particular to a packaging method for manufacturing electronic chip components with wafers. Background technique [0002] Common electronic chip components, as shown in A to C in FIG. 1 , are to manufacture the component structure on the ceramic substrate 100 first, and then cut the entire ceramic substrate with the complete component structure according to requirements by cutting machine 800 Become an individual electronic chip component unit 110; then use sputtering (Sputtering) or other methods to spray a layer of packaging material on the electronic chip component unit 110 through the sputtering device 900 and dry it; 3. or Using a coating method (not shown), the heat dissipation polymer layer is coated on the electronic chip component unit 110 , that is, the packaged electronic chip component is obtained. [0003] The above-mentioned electronic chip packaging manufacturing method has certain effects,...

AI Technical Summary

Problems solved by technology

[0003] The above-mentioned electronic chip packaging manufacturing method has certain effects, but there are still deficiencies in implementation: 1. Utilize the coating method to coat the heat-dissipating polymer layer on the electronic chip element unit after cutting, or sputtering (Sputtering) The method of spraying a layer of film on the electronic chip unit by the sputtering equipment is time-consuming and labor-intensive because it is for a single electronic chip component unit. The chip component unit is covered, and the packaging film on the wiring surface must be removed when using it. The production process is too many and inconvenient

[0004] Because the above-mentioned packaging method has its disadvantages, there is another packaging method. After the electronic chip components are formed on the substrate, the electronic chip components on the substrate are first coated with a packaging film, and then cut into electronic chip component units. This kind of packaging method cannot cover the surrounding surface of electronic chip components with packaging film, and often needs to be packaged for the second time during use, which is also inconvenient

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