Substrate processor and substrate processing method

A substrate processing device and substrate processing method technology, applied in the direction of chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as the inability to provide processing liquids for wafers
CN1440055AInactive Publication Date: 2003-09-03TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2003-09-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

A substrate processing apparatus for processing a substrate with a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.
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Description

technical field

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing cleaning treatment on substrates such as semiconductor wafers and glass for LCD substrates. Background technique

[0002] For example, in a manufacturing process of a semiconductor device, a processing system is used that cleans the surface of a semiconductor wafer (hereinafter referred to as "wafer"), removes a protective film, and the like. As a substrate processing apparatus that can be included in a processing system, there is known a blade-type substrate processing apparatus that supplies a processing liquid to a horizontal wafer and performs processing. In the existing blade-type substrate processing apparatus, from the viewpoint of preventing contamination caused by particle adhesion and reducing the consumption of processing fluid, during wafer processing, the plate-shaped upper member is brought close to the upper surface of the w...

Claims

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