Substrate processor and substrate processing method

A substrate processing device and substrate processing method technology, applied in the direction of chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc., can solve problems such as the inability to provide processing liquids for wafers

Inactive Publication Date: 2003-09-03
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, when it is desired to adopt a method of supplying processing fluid to the upper surface of the wafer when the upper member is close to the wafer, if the shaft of the rotation drive mechanism is not penetrated, the processing fluid cannot be supplied to the wafer.

Method used

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  • Substrate processor and substrate processing method
  • Substrate processor and substrate processing method
  • Substrate processor and substrate processing method

Examples

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Embodiment Construction

[0064] Hereinafter, a substrate cleaning unit, which is a substrate processing apparatus for cleaning a wafer as an example of a substrate, will be described. figure 1 It is a plan view of the cleaning processing system 1 in which the substrate cleaning units 12, 13, 14, and 15 of this embodiment are combined. figure 2 is its side view. This cleaning processing system 1 is composed of a cleaning processing unit 2 that performs cleaning processing on wafers W and heat treatment after the cleaning processing, and a loading and unloading unit 3 that loads and unloads wafers W from the cleaning processing unit 2 .

[0065] The loading and unloading section 3 is composed of an entrance and exit 4 provided with a mounting table 6 for mounting containers (containers C) capable of horizontally holding, for example, 25 wafers W at predetermined intervals, and has containers C mounted on the mounting table 6 and a washing machine. The wafer transfer unit 5 of the wafer transfer device...

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Abstract

A substrate processing apparatus for processing a substrate with a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61, the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method for performing cleaning treatment on substrates such as semiconductor wafers and glass for LCD substrates. Background technique [0002] For example, in a manufacturing process of a semiconductor device, a processing system is used that cleans the surface of a semiconductor wafer (hereinafter referred to as "wafer"), removes a protective film, and the like. As a substrate processing apparatus that can be included in a processing system, there is known a blade-type substrate processing apparatus that supplies a processing liquid to a horizontal wafer and performs processing. In the existing blade-type substrate processing apparatus, from the viewpoint of preventing contamination caused by particle adhesion and reducing the consumption of processing fluid, during wafer processing, the plate-shaped upper member is brought close to the upper surface of the w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/687
CPCH01L21/6719H01L21/68792H01L21/67051H01L21/68728H01L21/304
Inventor 黑田修谷山博己户岛孝之
Owner TOKYO ELECTRON LTD
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