Unlock instant, AI-driven research and patent intelligence for your innovation.

Composition for cleaning

A composition and cleaning technology, applied in the preparation of detergent composition, non-surface active detergent composition, detergent mixture composition, etc., can solve the problem of unrevealed cleaning type photoresist residue, difficult photoresist Residue and other issues

Inactive Publication Date: 2003-09-10
SHIPLEY CO INC
View PDF7 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The published patent application does not disclose the clean type or photoresist or photoresist residue of any type of substrate, photoresist residue that is difficult to emulsify alone

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0048] Photoresist residue dissolution

[0049] The photoresist is an adhesive composed of 50% by weight of acrylic acid polymer; 37% by weight of acrylic acid monomer; 10% by weight of a photoinitiator combination using hexaarylbiimidazole as a photoinitiator; and The remainder of the composition consists of dyestuffs, stabilizers and flow agents in usual amounts. Collect the residue accumulated by the photoresist on the developing equipment for solubility test. The parts of this equipment are composed of the materials shown in Table 2 below.

[0050] About 0.1 g of photoresist residue was added to each 100 mL of cleaning solution for evaluation. As shown in Table 1 below, nine cleaning solutions were tested. A stir bar was added to each mixture and stirred at 100 RPM. Keep the temperature constant at the selected value. Samples were tested at an ambient temperature of 21°C (70°F) and a temperature of 49°C (120°F). The mixture was monitored every 1...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a cleaning composition composed of a non-chelating organic acid, salt or ester thereof, and a chelating organic acid, salt or ester thereof that may be used to clean residue and scum from a substrate. The cleaning composition is suitable for cleaning residue and scum derived from photoresist.

Description

technical field [0001] The present invention relates to cleaning compositions and cleaning methods for cleaning accumulated organic residues from substrates. In particular, the present invention relates to cleaning compositions and cleaning methods for cleaning organic residues deposited from photoresists from substrates. Background technique [0002] Organic contaminants such as residues and scum accumulated from photoresists present difficult cleaning problems in the electronics industry where organic residues and scum accumulate on various products and instruments during the manufacturing process. Photoresist materials are used in the manufacture of semiconductor devices and electronic parts, such as integrated circuits, photomasks for manufacturing integrated circuits, printed circuit boards, etc., and lithographic printing plates. During the processing steps for the manufacture of electronic devices and components from photolithography, the surface of the substrate is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C11D7/26C11D7/32C11D7/34C11D7/60C11D11/00C11D17/00G03F7/42H01L21/304H01L21/306
CPCC11D7/3245C11D7/34H01L21/02052C11D11/0047C11D7/32G03F7/426C11D7/266C11D7/265C11D2111/22C11D7/26
Inventor E·安祖拉斯R·K·巴尔D·E·伦迪C·奥康纳
Owner SHIPLEY CO INC