Dispatching component for associating mfg. facility service requestors with service providers

A technology for service requests and manufacturing equipment, which is applied in the direction of control/adjustment system, program control, computer control, etc., can solve the problems of reducing the wafer processing output of processing equipment, unscheduled maintenance or downtime process interruption, etc., to improve efficiency and productivity effect

Inactive Publication Date: 2003-10-29
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Process interruption due to unscheduled maintenance or downtime of tools
As a result, there are frequ

Method used

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  • Dispatching component for associating mfg. facility service requestors with service providers
  • Dispatching component for associating mfg. facility service requestors with service providers
  • Dispatching component for associating mfg. facility service requestors with service providers

Examples

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Embodiment Construction

[0022] figure 2 An example of manufacturing equipment suitable for implementing and utilizing the principles of the invention is shown. now refer to figure 2 An automated semiconductor fabrication facility 200 is described for use in the fabrication of semiconductor devices by executing one or more fabrication service plans. The device 200 includes a number of resource nodes 202 each connected to another node by means of a data bus 220 , a number of user interfaces 224 and a computing master server 228 . Each resource node 202 (ie, a service provider or service requester as described below) is associated with a manufacturing facility 200 for monitoring resources. In the contemplated embodiments of the present invention, resource nodes 202 perform tasks by computer programs or computing servers residing in or connected to their respective resources. For example, a resource node includes hardware or software that can perform tasks, eg, in a computing processor at the resour...

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PUM

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Abstract

Improves the efficiency and productivity of manufacturing facilities by providing a program that dynamically matches service requesters with service providers. In addition, embodiments of the present invention match service requesters with service providers who are currently able to provide the requested service. In particular, during the execution of the process plan, information or messages are sent by the service provider to help identify the services currently available. Similarly, a service requester issues a service request. Next, service offers and service requests are placed in the dispatch station associated with the requested service. A service requester and a service provider are combined here to form a service requester/service provider group. Groups of service requesters/service providers are then rated as scheduling options. Once rated, a group of service requesters/service providers is selected in an automated fashion, validated against user-defined operating criteria, and dispatched to meet service requirements.

Description

technical field [0001] Generally, the present invention relates to manufacturing automated equipment, and more particularly to automated processes for manufacturing semiconductor devices. Background technique [0002] Semiconductor manufacturing is an extremely complex, multi-step process subject to stringent manufacturing requirements and production schedules. These manufacturing processes are typically performed in large manufacturing facilities that often incorporate a large number of tools involved in the various stages of the manufacturing process. [0003] Typical semiconductor devices are manufactured using complex processes including, for example, a large number of oxidation, etching and photolithography processes. use figure 1 An example of this process or service plan is described in Process 10. Each step in process 10 typically requires a high degree of product and process control. For example, impurities and particulate contamination must be strictly controll...

Claims

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Application Information

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IPC IPC(8): G06Q50/04G05B19/418
CPCG05B19/41865G05B2219/32258G05B2219/32328Y02P90/02G06Q50/04
Inventor Y·T·迟P·C·M·霍金斯C·Q·黄Q·金S·莫罕N·A·沃德
Owner APPLIED MATERIALS INC
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