Semiconductor device
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- FUJITSU SEMICON LTD
- Publication Date
- 2003-12-03
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a semiconductor device, and more particularly, to a semiconductor device having a fuse for repairing defects found after manufacture. Background technique
[0002] A semiconductor device including memory circuits has a redundant memory array for repairing memory defects found after manufacture. The repair process disconnects the defective memory cell array from other circuits by blowing laser programmable fuses provided in the device, and restores its functionality with the now activated redundant array. In this chip structure, the fuse patterns are respectively disposed under rectangular guard rings, so that the laser beams irradiated inside the guard rings will irradiate the desired fuse patterns. 6(A) and (B) illustrate guard ring and fuse patterns formed in one semiconductor device. Specifically, FIG. 6(A) is a plan view, and FIG. 6(B) is a cross-sectional view taken along line 100-100 in FIG. 6(A).
[0003] As s...