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Adhesive and electric device

A technology of adhesives and peak positions, which is applied in the direction of conductive adhesives, adhesives, film/sheet adhesives, etc., can solve the problem of difficult to obtain reliable electrical components, poor reliability of electrical components, adhesive 112 tortoise Crack and other issues

Inactive Publication Date: 2003-12-17
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when inorganic fillers or rubber components are dispersed in the adhesive 112, cracks may occur inside the adhesive 112 due to sudden changes in temperature.
In particular, when fillers are added, cracks are likely to occur inside the adhesive 112 due to the low rigidity of the cured adhesive 112.
As a result, the reliability of the resulting electrical components is poor
In short, it is difficult to obtain highly reliable electrical components using conventional adhesives

Method used

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  • Adhesive and electric device
  • Adhesive and electric device
  • Adhesive and electric device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] First, in 60 parts by weight of epoxy resin, a thermosetting resin material, 30 parts by weight of conductive particles (diameter 5 μm) composed of resin particles (metal-plated particles) with a gold-plated layer and a nickel-plated layer formed on the surface and 30 parts by weight of the average particle size were added. 60 parts by weight of filler materials composed of two filler components having different diameters were mixed thoroughly to obtain a paste-like adhesive. Here, silica (filler component A) with an average particle diameter of 1.6 μm and silica (filler component B) with an average particle diameter of 0.9 μm are used as fillers in a ratio of 2 parts by volume of filler component A For 1 part by volume filler component B.

[0037] Next, this adhesive is molded into a film to produce an adhesive film composed of the adhesive of the present invention. Figure 1A The symbol 15 in : represents this adhesive film, and the adhesive constituting the adhesive...

Embodiment 2～12

[0056] E: Alumina with an average particle diameter of 1.5 μm [Examples 2-12, Comparative Examples 1-3]

[0057] Using the same resin material and conductive particles as in Example 1, the composition of the filler material used in Example 1 was changed, and the adhesive films of Examples 2-12 and Comparative Examples 1-3 were produced. The types and proportions of the filler materials contained in the filler materials of Examples 2-12 and Comparative Examples 1-3 are listed in the filler proportion column of Table 1.

[0058] Using these adhesive films 15, the same substrate 13 as used in Example 1, and the semiconductor chip 11, according to Figure 1B , Figure 1C These substrates 13 were connected to the semiconductor chip 11 in the following steps, and the electrical devices 5 of Examples 2 to 12 and Comparative Examples 1 to 3 were produced respectively.

[0059] Using the adhesive films 15 and electrical device 5 of Examples 2 to 12 and Comparative Examples 1 to 3, un...

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Abstract

The particle diameter distribution of the filler material added to the adhesive of the invention has the first peak and the second peak positioned on a side of smaller particle diameters with respect to the first peak by 0.7mu or more, and thus the rigidity of the hardened adhesive is improved. Therefore, the connection reliability of the electric device 5 having the semiconductor chip 11 and the substrate 13 by using the adhesive (adhesive film 15 ) is improved.

Description

technical field [0001] This invention relates to adhesives, and more particularly to adhesives for attaching semiconductor chips to substrates. Background technique [0002] In the past, in order to bond semiconductor chips to substrates, adhesives made of thermosetting resins or thermoplastic resins were used. [0003] Figure 7 Reference numeral 101 in , denotes an electrical device 101 constituted by bonding a semiconductor chip 111 to a substrate 113 with an adhesive 112 . The protruding terminals 121 provided on the semiconductor chip 111 are already properly bonded to the terminals 122 constituted by a part of the wiring pattern on the substrate 113 . In this state, the internal circuit in the semiconductor chip 111 is electrically connected to the wiring pattern on the substrate 113 through the terminals 121 and 122 . The curing of the resin constituting the adhesive 112 mechanically connects the semiconductor chip 111 and the substrate 113 via the adhesive 112 . ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/00C08L63/00C09J9/02C09J11/04C09J201/00H01L21/52H01L21/56
CPCH01L24/29H01L2924/01074H01L2924/0103H01L2924/01027H01L2924/01047C09J9/02H01L2924/01087H01L2924/01029H01L2224/73204H01L24/32H01L2924/01057H01L21/563H01L2924/0102H01L2224/83101H01L2924/01013H01L2924/0104H01L2924/01005H01L2924/01082C09J11/04H01L2924/01033H01L2224/32225H01L2924/01079H01L2924/01004H01L2924/3011H01L2924/10253C08L63/00H01L2224/83192H01L2924/01045H01L2924/01006H01L2924/01078H01L2924/19043H01L2224/73203H01L2924/01019H01L2224/16225H01L2224/83856H01L2924/12042H01L2924/351H01L2924/00H01L2924/3512
Inventor 阿久津恭志
Owner DEXERIALS CORP