Semiconductor device, electronic appts. their mfg. methods and electronic instrument

A semiconductor and device technology, applied in the field of semiconductor devices, can solve the problems of difficulty in stacking different types of components, difficulty in stacking different types of chips, and inability to improve the effectiveness of space saving.

Inactive Publication Date: 2004-08-11
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate, it is difficult to stack diffe

Method used

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  • Semiconductor device, electronic appts. their mfg. methods and electronic instrument
  • Semiconductor device, electronic appts. their mfg. methods and electronic instrument
  • Semiconductor device, electronic appts. their mfg. methods and electronic instrument

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Embodiment Construction

[0049] Semiconductor devices, electronic equipment and their manufacturing methods according to embodiments of the present invention will be described below with reference to the drawings.

[0050] figure 1 is a cross-sectional view showing the structure of the semiconductor device of the first embodiment. In this first embodiment, on the semiconductor package PK11 on which the semiconductor chip (or semiconductor die) 13 is mounted by ACF bonding, the semiconductor package PK12 and the wire bonded semiconductor chip (or semiconductor die) 23a to 23c of the stacked structure are laminated respectively. The semiconductor package PK13 of the stacked semiconductor chips (or semiconductor dies) 33a to 33c is connected by soldering.

[0051] figure 1 In this example, a carrier substrate 11 is provided on the semiconductor package PK11, and connection platforms 12a and 12c are respectively formed on both sides of the carrier substrate 11, and internal wiring 12b is formed in the c...

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PUM

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Abstract

A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes and to lands which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate so that ends of the second and third carrier substrates are arranged above a semiconductor chip.

Description

technical field [0001] The present invention relates to a semiconductor device, an electronic device, an electronic instrument, a manufacturing method of a semiconductor device and a manufacturing method of an electronic device, and is especially suitable for a stacked structure of semiconductor components and the like. Background technique [0002] In conventional semiconductor devices, in order to save space when semiconductor chips are mounted, there is a method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate as disclosed in Japanese Unexamined Patent Publication No. 10-284683, for example. [0003] However, in the method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate, it is difficult to stack different types of modules, and since it is difficult to stack different types of chips, there is a problem that the effectiveness of space saving cannot be improved. Cont...

Claims

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Application Information

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IPC IPC(8): H01L25/18H01L23/31H01L23/52H01L25/065H01L25/10H01L25/11
CPCH01L2225/1058H01L2224/45124H01L23/3128H01L2924/3511H01L2224/16H01L2225/1005H01L2225/1023H01L2924/15311H01L2224/48091H01L23/3114H01L2224/32225H01L2924/15331H01L2225/06568H01L2224/73204H01L24/48H01L2924/01079H01L2224/48465H01L25/105H01L25/0657H01L2224/48227H01L2224/32145H01L25/03H01L2924/01078H01L2224/45144H01L2224/16225H01L2224/73265H01L2225/06562H01L24/45H01L24/73H01L2924/00014H01L2924/181H01L2924/00012H01L2924/00H01L2224/05599H01L2224/0401
Inventor 泽本俊宏
Owner SEIKO EPSON CORP
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