Semiconductor device, electronic appts. their mfg. methods and electronic instrument

A semiconductor and device technology, applied in the field of semiconductor devices, can solve the problems of difficulty in stacking different types of components, difficulty in stacking different types of chips, and inability to improve the effectiveness of space saving.
CN1519930AInactive Publication Date: 2004-08-11SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SEIKO EPSON CORP
Publication Date
2004-08-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes and to lands which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate so that ends of the second and third carrier substrates are arranged above a semiconductor chip.
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Description

technical field

[0001] The present invention relates to a semiconductor device, an electronic device, an electronic instrument, a manufacturing method of a semiconductor device and a manufacturing method of an electronic device, and is especially suitable for a stacked structure of semiconductor components and the like. Background technique

[0002] In conventional semiconductor devices, in order to save space when semiconductor chips are mounted, there is a method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate as disclosed in Japanese Unexamined Patent Publication No. 10-284683, for example.

[0003] However, in the method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate, it is difficult to stack different types of modules, and since it is difficult to stack different types of chips, there is a problem that the effectiveness of space saving cannot be improved. Cont...

Claims

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