Semiconductor device, electronic appts. their mfg. methods and electronic instrument

A manufacturing method and semiconductor technology, which are applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve the problem of low space saving effectiveness
CN1519931AInactive Publication Date: 2004-08-11SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SEIKO EPSON CORP
Publication Date
2004-08-11
Estimated Expiration
Not applicable · inactive patent

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Abstract

A method is provided to realize a three-dimensional mounting structure of different types of packages. By bonding protruding electrodes onto lands, which are formed on a first carrier substrate, second and third carrier substrates are mounted on the first carrier substrate such that ends of the second and third carrier substrates are arranged above a semiconductor chip.
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Description

field of invention

[0001] The present invention relates to a semiconductor device, an electronic device, an electronic instrument, a method for manufacturing the semiconductor device, and a method for manufacturing the electronic device. It is especially suitable for lamination structures of semiconductor components and the like. Background technique

[0002] In existing semiconductor devices, in order to save space when semiconductor chips are mounted, there is a method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate as shown in Japanese Patent Application Laid-Open No. 10-284683, for example.

[0003] However, in the method of three-dimensionally mounting semiconductor chips while inserting the same type of carrier substrate, it is difficult to stack different types of modules, and because of the difficulty in stacking different types of modules, there is a problem that the effectiveness of space saving is not high. ...

Claims

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