Method for preparing slice type network resistor and slice type network resistor prepared by the same method

Abstract

The invention discloses a manufacturing method for a kind of piece network resistance and the product. The method includes following steps: (1) it forms two pairs or more separated front poles on the upper surface of the insulating base piece; (2) forms two or more resistance layers connected to each pair of front surface poles on the insulating base piece; (3) forms a protection layer on the resistance layer; (4) forms the side poles on the convex part on the side surface of the base piece. It uses subjacent coating mode to add pole pulp on the convex part of the side surface in step (4). The invention can avoid the short pass between the side poles; the piece network resistance has excellent performance.

Description

technical field [0001] The invention relates to a manufacturing method of a chip network resistor and the manufactured chip network resistor, in particular, the invention relates to a manufacturing method of a side electrode of a chip network resistor. Background technique [0002] A typical chip network resistor includes a rectangular insulating substrate, a plurality of resistance layers with the required resistance value formed on it, and a plurality of pairs of terminal electrodes connected to the resistance layer are formed at both ends of the resistance layer, and in order to protect the resistance layer and a protective layer covering the resistive layer is formed on it. [0003] A typical structure of the above-mentioned chip network resistor is as follows: Figure 8 As shown, it includes: an insulating substrate 1, a resistive layer 2 formed on the insulating substrate 1, terminal electrodes 3 (the terminal electrodes are located at the two ends of the resistive lay...

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Problems solved by technology

However, when the dimensions of chip network resistors are miniaturized and the depth of the grooves on both sides of the insulating substrate is reduced to a certain extent, the above method of applying side electrode paste is not applicable.

Because the amount and thickness of the slurry applied by the above two methods are difficult to control, the electrode slurry has a certain fluidity, and the groove depth of the insulating substrate is very small and the upper end surface of the insulating substrate is applied first, so it is often There is a phenomenon that the slurry between the side electrodes on the same side flows into the groove and communicates with each other, resulting in a short circuit between the terminal electrodes, which leads to product failure. Such failed chip network resistors such as Figure 9 As shown, 3b' in the figure is the side electrode slurry flowing into the groove

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