233results about How to "Improve performance reliability" patented technology

An optical system comprises an optical apparatus arranged to direct received light to different paths and to provide a first signal and a second signal, said first and second signals having an optical difference therebetween sufficient for distinguishing optical signals, an amplifier in optical communication with the optical apparatus for amplifying the first and second signals, and a discrimination device to receive amplified light and to provide output light responsive to the optical difference.

A system for evaluating a redox flow battery according to an embodiment of the present disclosure includes: a control unit configured to control the path of a flow channel connected between a detection cell and the redox flow battery or a flow channel connected between the detection cell and an agitator; and an evaluation unit configured to evaluate any one of the state of charge, capacity fade and oxidation number balance of an electrolyte, which is used in the redox flow battery, by measuring a current or voltage of the detection cell based on the controlling of the path by the control unit. According to the present disclosure, the capacity fade problem of a redox flow battery can be quickly coped with by evaluating the information of the positive and negative electrode electrolytes on battery capacity fade and information about the valence balance of the electrolytes in situ.

The invention discloses a machine vision based turn plate angle high-precision online measurement method. Real time image collection is performed on mark round hole points in a turn plate by utilizinga monocular industrial camera. Through vision and image metrology analysis on acquired images, position information of the mark round hole points in the turn plate can be obtained. Then rotation angle information can be calculated through a geometric method. The advantages of the invention achieved in angle measurement include high measurement speed and realization of real time online measurement; avoidance of influence and damage to working piece surface through implementation of a measurement function by adoption of a non-contact technology; and elimination of interference on measurement results due to lighting environment complexity, spray liquid, water spots and the like in a production field through adoption of an improvement algorithm in the highest level.

A method for mobile underwater acoustic communications includes double differentially (DD) encoding a communication signal to produce a DD-encoded communication signal, applying direct sequence spread spectrum (SS) to the DD-encoded signal to produce a DD-SS communication output signal, and transmitting the DD-SS communication output signal. The method i) increases the SNR via processing gain, ii) eliminates the ISI through multipath suppression, and iii) enables bandwidth efficiency improvement via data multiplexing. The method is shown capable of facilitating simple receiver processing and offering performance robustness against unpredictable channel fluctuations.

A semiconductor lamination portion is formed on a substrate by laminating semiconductor layers so as to form a light emitting layer, and a plurality of light emitting units are formed by separating the semiconductor lamination portion electrically into a plurality of units. Each of the units has a pair of electric connecting portions which are connected to a pair of conductivity type layers and they are connected to each other with a wiring film. Each of the plurality of the light emitting units is separated electrically by dividing the conductivity type layers of the semiconductor lamination portion with at least twofold separating grooves (a first separating groove and a second separating groove). As a consequence, a semiconductor light emitting device with a high luminance and being formed in a monolithic type having a plurality of light emitting units can be obtained to solve a problem of a short-circuit occurrence between the light emitting units while keeping high reliability of wiring or the like.

The invention discloses a manufacturing method for a kind of piece network resistance and the product. The method includes following steps: (1) it forms two pairs or more separated front poles on the upper surface of the insulating base piece; (2) forms two or more resistance layers connected to each pair of front surface poles on the insulating base piece; (3) forms a protection layer on the resistance layer; (4) forms the side poles on the convex part on the side surface of the base piece. It uses subjacent coating mode to add pole pulp on the convex part of the side surface in step (4). The invention can avoid the short pass between the side poles; the piece network resistance has excellent performance.

An on-vehicle electronic control device is provided, which includes an auxiliary microprocessor and subjects a microprocessor allocated to a main part of control to an external diagnosis, thereby improving reliability of performance. A microprocessor (110a) including a nonvolatile program memory (115a) into which a control program is written is serially connected to an auxiliary microprocessor (120a) including an auxiliary nonvolatile program memory (125). The microprocessor (110a) and the auxiliary microprocessor (120a) functions in cooperation to control on-vehicle electric load groups (104a and 104b) in response to input signals from on-vehicle sensor groups (102a and 102b) and an on-vehicle analog sensor group 103a. The nonvolatile program memory (115a) and the microprocessor (110a) are subjected to runaway monitoring performed by a watchdog timer (130) and to an external checksum diagnosis performed periodically by the auxiliary microprocessor (120a). If an anomaly occurs in the run away monitoring, the external checksum diagnosis, and a checksum interval, parts of electric loads are cut off of power supply by load power relay (107a).

A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

The invention relates to a motor, in particular to a chute low-noise motor, which comprises a machine seat, a stator, a rotor and a rotating shaft, wherein the stator, the rotor and the rotating shaft are arranged on the machine seat, the rotor comprises at least two sections of rotor iron cores, the rotor iron cores are punched and laminated by a false axis inclination angle taper key method to form chute iron cores; chutes of the adjacent chute iron cores are in opposite directions and are in arrangement in a way of staggering for an angle alpha. Therefore, the chute low-noise motor has the following advantages that 1, great-degree optimization is respectively realized in aspects of vibration, noise, iron core laminating quality, cast aluminum quality and chute cast aluminum rotor structure adopted by a high-power motor, and the chute low-noise motor is suitable for small and medium-sized cast aluminum rotor structure alternating current motors with higher vibration and noise requirements; 2, the stress uniformity and the rigidity of iron core laminating punching are fundamentally ensured, the iron core laminating quality is improved, the influence of deformation on vibration noise is reduced, the aluminum overflowing and bubble problems are solved, and the quality of the cast aluminum rotor and the motor performance reliability are improved.

A new method and package is provided for the mounting of semiconductor devices that have been provided with small-pitch Input/Output interconnect bumps. Fine pitch solder bumps, consisting of pillar metal and a solder bump, are applied directly to the I/O pads of the semiconductor device, the device is then flip-chip bonded to a substrate. Dummy bumps may be provided for cases where the I/O pads of the device are arranged such that additional mechanical support for the device is required.

The inventive surgical light comprises a body provided with main light-emitting diodes and additional light-emitting diodes arranged therebetween, which are spaced on said body and fixed thereto, wherein said additional light-emitting diodes are grouped and are characterised in that the spatial orientation thereof differs from the spatial orientation of the main light-emitting diodes. A light field control device comprises a control unit to which the groups of light-emitting diodes are connected by means of adjusters each of which is connected to a power supply unit. The main light-emitting diodes are fixed to the light body in such a way that the optical axes thereof cross the light axis in the center of a light spot. The additional light-emitting diodes are fixed to the light body in such a way that the optical axes thereof form a concentric light spot in the form of a ring around the main light spot.

The invention discloses an array substrate, a manufacturing method therefore, and a display panel. The array substrate includes a plurality of thin film transistor, and each thin film transistor comprises a gate electrode, an oxide semiconductor layer, and an etching barrier layer, wherein the etching barrier layer is located on the oxide semiconductor layer which includes a channel region and a non-channel region, the non-channel region includes an electrode region and a connection region, and the electrode region includes a first electrode region and a second electrode region. Each connection region includes a first connection region and a second connection region, and the first electrode region, the first connection region, the channel region, the second connection region and the secondelectrode region are sequentially arranged in a first direction, and the first direction is parallel to the array substrate. A region, covered by the corresponding etching barrier layer, of each oxide semiconductor layer is a channel region. Each gate electrode is located at one side, far from the corresponding etching barrier layer, of the corresponding oxide semiconductor layer. The width of atleast one connection region is less than the width of the channel region in a second direction. The overlapping area of the gate electrodes with the non-channel regions is reduced, and the parasiticcapacitance is also reduced.

The present invention relates to an automatic multi-performance evaluation system for hybrid speech recognition and, more particularly, to an automatic multi-performance evaluation system for hybrid speech recognition capable of automatically evaluating a processing result of speech recognition and language understanding through a hybrid terminal and a processing result of server speech recognition and language understanding through a cloud server by simultaneously using the hybrid terminal and the cloud server, to thereby output an accurate and fast performance and function verification result.