6results about How to "Reduce connection strength" patented technology

The utility model relates to the technical field of new energy batteries, and discloses a battery box body and a battery pack, the structural strength of the frame corners of the battery box body is high, so that the connecting seams of the frame corners are not easy to crack, the overall reliability of the battery box body is better, and the battery box body can meet the use requirements. The battery box body comprises a frame and a reinforcing piece, at least one corner part of the frame comprises a first surface, a second surface and a third surface which are connected in sequence, at least one of the first surface, the second surface and the third surface is provided with a connecting seam, and the reinforcing piece wraps at least part of the outer surfaces of the first surface, the second surface and the third surface.

The utility model relates to the technical field of batteries, and discloses a battery module which comprises a battery cell, a buffer structure and colloid, the plurality of battery cells are arranged side by side along a first direction, and each battery cell is provided with two first side surfaces which are oppositely arranged along the first direction; a buffer structure is arranged between two adjacent battery cells, a glue injection groove is formed in the buffer structure, a buffer groove is defined by the buffer structure, and the first side surfaces of the two adjacent battery cells are arranged at intervals through the buffer groove; the colloid is arranged in the glue injection groove, and the first side faces of the two adjacent battery cells are bonded through the colloid. According to the utility model, the buffer groove is arranged to provide a buffer space for the expansion of the battery cell in the circulation process, so that the expansion of the battery cell in the circulation process can be borne by the buffer groove, and the circulation attenuation caused by overlarge internal pressure due to overlarge expansion in the later period of the battery cell circulation is avoided; the glue injection groove is formed in the buffer structure, so that the pouring space of the glue is limited, the glue is prevented from occupying the buffer space, and the structural strength of the battery module is enhanced.

The utility model discloses a three-dimensional bag which comprises a bag body with a containing cavity and a handle arranged at an opening of the bag body, a handle penetrating hole is formed in the position, close to one side of a bag opening, of the side wall of the bag body and corresponds to the end portion of the handle, and the end portion of the handle penetrates through the handle penetrating hole from one side of the side wall of the bag body and extends to the other side of the side wall of the bag body. And the handle is connected with the other side surface of the side wall of the bag body. Moreover, in the height direction of the bag body, a connecting area is formed between the handle through hole and the upper edge of the side wall of the bag body, the connecting area has a preset height in the height direction, and the ratio of the preset height to the height of the bag body is within the range of 1: (6-12). On one hand, the connecting part of the handle and the bag body moves downwards from the easily-worn edge of the bag opening, so that the connecting stability of the handle and the bag body is improved, and normal use of the three-dimensional bag and safe loading of articles are guaranteed; on the other hand, the connecting area can be used for installing accessories for closing the bag opening, a head clamp or a decorating part for enhancing the edge strength of the bag opening and the like.

This utility model belongs to the field of EMC grounding structure, specifically disclosing an EMC grounding terminal and its components. The EMC grounding terminal includes a grounding conductor and a connecting block for interference fit on the inner wall of a conductive housing. The grounding conductor has pins for conductive connection to a circuit board, and the connecting block has a protrusion. The grounding conductor passes through the protrusion and is connected to the connecting block. The inner edge of the grounding conductor has several first deformation portions, which are interference fit with the outer peripheral surface of the protrusion. The outer edge of the grounding conductor has several second deformation portions for interference fit with the inner wall of the conductive housing. The EMC grounding assembly includes a conductive housing, a circuit board, and the aforementioned EMC grounding terminal. This solution can achieve a grounding terminal that reduces space occupation, ensures connection strength, and obtains good EMC performance.

The present disclosure provides a semiconductor device manufacturing method. The semiconductor device manufacturing method comprises the following steps: providing a semiconductor substrate, then forming a capacitor structure above the semiconductor substrate, and forming an interlayer dielectric layer above the capacitor structure. The present disclosure processes the interlayer dielectric layer as follows: first processing the interlayer dielectric layer to form a plurality of columnar protrusions on the interlayer dielectric layer; second processing the interlayer dielectric layer to reduce the height of the columnar protrusions; and finally, chemically mechanically polishing the interlayer dielectric layer to make the upper surface of the interlayer dielectric layer flush, thereby achieving the effect that the upper surface of the interlayer dielectric layer is planarized. In the present disclosure, the first processing can be dry etching, and the second processing can be wet etching. Compared with the prior art, the technical solution provided by the present disclosure can effectively eliminate the step height difference between different positions on the device while protecting the interlayer dielectric layer that needs to be reserved.

The utility model provides a new energy vehicle battery PACK box body belongs to battery PACK box body technical field, include PACK lower box body ontology still include: protection mechanism, protection mechanism includes the upper plate fixed in PACK lower box body bottom, the bottom fixed connection ring of upper plate, the bottom fixed lower plate of connection ring, the thickness of upper plate is greater than the thickness of lower plate, the utility model discloses through setting upper plate, lower plate and connecting strip, upper plate is fixed in PACK lower box bottom, lower plate is fixed in lower plate bottom through connecting strip, when the knock, lower plate deformation, the buffer cavity is formed between upper plate and lower plate, and the buffer cavity is used to accommodate the deformation of lower plate when being knocked, and is influenced by the thickness of upper plate is greater than the thickness of lower plate, when the lower plate is deformed and is pressed against the upper plate, the upper plate of greater thickness can also effectively resist the greater deformation of the lower plate, greatly reduce the influence to the liquid cooling plate and battery in the PACK lower box body ontology, thereby improve the protection ability to the liquid cooling plate and battery.