180results about How to "Reduce connection strength" patented technology

In a semiconductor device in which a semiconductor chip is stacked on a substrate, an interposer chip having wirings is provided under the semiconductor chip. A bonding pad of the semiconductor chip is electrically connected to a bonding terminal provided on the substrate via the interposer chip by wire bonding. The interposer chip prevents a semiconductor element formed in the semiconductor chip from deteriorating in terms of an electric property and from being physically damaged. Further, the wire bonding strength does not drop. Moreover, it is possible to form a fine wiring pitch for relaying a wire-bonding wire.

An electronic component mounting base board has an insulating substrate provided with a conductor circuit and a mount portion for an electronic component, and a heat slug adhered to the insulating substrate, wherein the heat slug is comprised of a flat main body and a projection portion extending vertically from a side face of the main body, and provided with a slit deforming portion absorbing deformation of the insulating substrate.

The invention discloses a truss combined beam and upper and layer connected light steel structure and a construction method thereof. The light steel structure comprises upper wall sheet columns distributed at intervals, lower wall sheet columns distributed at intervals, upper wall sheet column lower connecting pipes connected among the lower parts of the upper wall sheet columns, lower wall sheet column upper connecting pipes connected among the upper parts of the lower wall sheet columns, and truss combined beams connected between the upper wall sheet columns and the lower wall sheet columns through upper and lower connectors, wherein the upper and lower connectors are beam passing buckles, the web plates of the beam passing buckles consist of upper web plates and lower web plates, a square connecting port is formed between the upper web plates and the lower web plates, upper chord member connecting plates are extended from the left and right sides of the square connecting ports, and the upper chord member connecting plates and side plates of the beam passing buckles are positioned in the same plane. Through the light steel structure, the structural stability of a light steel keel house system is enhanced, and the floor surface beams, the connecting pipes and the floor panels do not easily vibrate.

The invention relates to a resistance spot welding electrode and a manufacturing method thereof, and belongs to the technical field of resistance spot welding. The resistance spot welding electrode comprises a first conductor and a second conductor. A groove matched with the second conductor in appearance is formed in the lower end face of the first conductor. The second conductor is inlaid in the groove. The lower end face of the second conductor is flush with the lower end face of the first conductor. The electrical resistivity of the second conductor is larger than the electrical resistivity of the first conductor. A cooling groove is formed in the upper end face of the first conductor. When the resistance spot welding electrode is used for welding, the connection strength between metal plates can be improved; the manufacturing method is simple and convenient, and the manufactured resistance spot welding electrode is firm in combination, good in performance and high in strength.

The invention discloses a solder for welding a carbon/silicon carbide ceramic matrix composite material and a titanium-aluminum-based alloy and a soldering method, relating to solders and soldering methods thereof. By the invention, the problems that the using temperature of the welding joint of the conventional silver-based solder for welding composite materials and titanium alloys is low and the process of a traditional method for indirectly soldering the carbon/silicon carbide ceramic matrix composite materials and metals is complex. The solder comprises titanium material powder, nickel powder and boron powder. The method comprises the following steps of: performing ball milling on the solder, preparing the solder into paste, coating the paste on a joint face to be welded of the carbon/silicon carbide ceramic matrix composite material and the titanium-aluminum-based alloy, putting a piece to be welded into a vacuum heating furnace, heating and preserving heat to complete the welding. The joint welded by the invention has a shearing strength of 40-105MPa at the room temperature, a shearing strength of 30-70MPa at 600 DEG C and the using temperature of not less than 600 DEG C, the soldering process is simple, and the welding efficiency is high. The solder can be used for the welding the carbon/silicon carbide ceramic matrix composite material and the titanium-aluminum-based alloy or a titanium-aluminum-based alloy piece.

In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 μm or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10⁻³ (Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.

An electrically conductive adhesive composition comprising electrically conductive particles containing a metal of which melting point is 220° C. or less, a thermosetting resin, and a thermal cationic polymerization initiator.

A sprinkler head cover including a housing adapted to be attached to a sprinkler head which is connected to a water supply piping and in which, in the case of fire, a valve disposed inside the sprinkler head is opened to allow a fire-extinguishing liquid in the water supply piping to be dispersed. A cover plate is adapted to cover the sprinkler head so that the sprinkler head cannot be seen from outside, and a mount is installed in the housing and has a hole inside thereof. The cover plate and the mount are connected to each other by a low melting point alloy melted out from the hole, and a heat collector of the sprinkler head has a structure for allowing the heat collector to come into contact with the cover plate.

The invention provides a novel wafer level tin solder micro bump manufacturing method, and belongs to the field of semiconductor chip packaging. Photoresist of which the opening is formed through exposure development is utilized to act as a mask film firstly. A copper layer, a barrier layer and solder alloy are electroplated on an under bump metal layer in turn, and the solder alloy is enabled to completely wrap a copper layer-barrier layer of the bottom part. Then tin solder micro bumps are formed via a method of backflow and then photoresist removing. Finally the micro bumps act as an etching mask film and a wet etching technology is adopted to remove the excess under bump metal layer. Excessive etching of electroplating copper of a bump layer in isotropic etching of the under bump metal layer can be avoided, and bridging caused by collapsing of backflow of the micro bumps can be avoided so that reliability of the micro bumps and packaging products can be enhanced.

The invention discloses an optical fiber accessing plug with an integrated housing. The optical fiber accessing plug with the integrated housing comprises a housing, an inserting core subassembly connected with optical fiber and a tail protecting bush, wherein the inserting core subassembly comprises a ceramic inserting core and a ceramic inserting core tailstock fixed with the ceramic inserting core; the housing adopts an integrated cavity structure; a through hole is arranged at the front end of the housing, and a tail pipe is inserted into the tail part of the housing; the ceramic inserting core penetrates through the through hole; the front part of the tail pipe is in interference fitting with the internal wall of the housing through a backstopping barb on the external wall thereof; the tail protecting bush is connected with the back part of the tail pipe; and a spring used for providing fitting force for a plug in butting is arranged in an internal chamber of the housing between the ceramic inserting core tailstock and the tail pipe. According to the optical fiber accessing plug with the integrated housing provided by the invention, the housing adopts the integrated cavity structure and is composed of two parts compared with an existing plug, which is simpler in structure, and is more convenient and quicker in the producing and assembling processes; and the problem that the connection strength between parts of the structure comprising two parts is reduced during mutually plugging process can be avoided.

A wire-connecting device including a joint terminal for connecting an inner conductor of a coaxial cable and a core wire of an electric wire, and a heat-shrinkable member for covering at least the joint terminal and a cut edge of a braided wire of the coaxial cable exposed at the joint terminal.

A fiber-optic cable with a fitting capable of increasing connection strength between a fiber-optic cable and an optical connector, which includes a fiber-optic cable including a sheath and a tensile member, an inner ring mounted on a circumference of the sheath from a position where the tensile member is drawn out of the sheath through a slit to a front end of the sheath, and a fitting mounted on the circumference and including a first portion mounted from the position where the tensile member is drawn out of the sheath to a position of the sheath on a side opposite to the ring side, and a second portion mounted while covering a circumference of the ring, wherein the first portion connects with the sheath, and the end portion of the tensile member is sandwiched by the ring and the second portion.

The invention discloses an integrated forming manufacturing method of an I-shaped beam made from a composite material. The method comprises the following steps: I, preparing a die; II, clipping, impregnating and overlaying fiber cloth; III, laminating the fiber cloth in the die; IV, hot-pressing and curing the laminated fiber cloth through a hot-press and the die; and V, opening the die. The method provided by the invention has the following advantages that material damage caused by punching connection and low connecting strength between a flange and a web caused by gluing connection are overcome when the flange and the web of the split type I-shaped beam made from the composite material obtained by existing manufacturing method are combined and connected, and the integral strength of the I-shaped beam made from the composite material is improved.

To provide a sheath structure assembly coupling structure and a sheath structure assembly coupling method, with which excellent workability and a reduction in costs can be achieved; a reduction in the strength of the connection portion or in the electrical connection can be prevented and a uniform and excellent electrical connection, can be achieved; with which excellent durability is maintained for a long period even in the usage environment in which a great force such a tension or the like continuously acts; and with which break or a reduction in insulating performance can be avoided.

There is proposed a mounting structure including a plurality of components each having a plurality of solder bumps, a substrate having a plurality of lands, and a solder connecting portion for connecting the solder bump and the land, wherein the land provided in an outer peripheral portion of the substrate is smaller than that of the land in a central portion of the substrate.

A piezoelectric vibrating piece includes a rectangular vibrator, a framing portion, a connecting portion, and a protrusion. The rectangular vibrator vibrates at a predetermined vibration frequency. The framing portion surrounds a peripheral area of the vibrator. The framing portion includes an inner side surface facing the vibrator. The connecting portion connects the vibrator and the framing portion. The protrusion protrudes to the vibrator side. The protrusion is formed on at least one of the inner side surface facing a side of the vibrator where the connecting portion is connected and the inner side surface adjacent to the connecting portion.

The invention relates to a manufacturing process for a circuit board with long and short gold fingers, which comprises the following steps: supplying a base plate; arranging a plurality of gold finger patterns on the surface of the base plate; arranging a gold-plated lead with tip structures on the surface of the base plate; correspondingly and electrically connecting the tip structures of the gold-plated lead with the gold finger patterns; performing gold-plating treatment on the gold finger patterns so as to form the gold fingers; and tearing off and removing the gold-plated lead, thereby separating the tip structures of the gold-plated lead from the gold fingers. According to the manufacturing process for the circuit board provided by the invention, the tip structures are arranged at the end parts of the gold-plated lead, so that the gold-plated lead and the gold fingers are electrically connected while an area of a physical connecting structure between the gold-plated lead and the gold fingers is greatly reduced. When a test is finished, an operator can easily remove the gold-plated lead in the manner of pulling and tearing by hand, and the gold-plated lead is prevented from being remained, so that the change in electric properties of the gold fingers caused by the remained gold-plated lead is avoided, the short circuit risk is eliminated and the reliability of products is increased.