Joining process of laminated multi-layer thick film circuit

Abstract

The invention discloses a joining process and preparation method of a laminated multi-layer thick film circuit. The jointing process comprises the following steps: printing S protective glaze materials on the surfaces of thick film circuit diaphragms to be joined; printing a plurality of E-material blocks for joining on shared corresponding points of the thick film circuit diaphragms; finally, laminating surfaces to be joined, of the thick film circuit diaphragms, putting into a sagger mold, and sintering for 20-30 minutes at 480-520 DEG C; or the joining process comprises the following steps: printing low-temperature sliver slurry F on thick film circuit diaphragms to be electrically joined; printing the S protective glaze materials on the surfaces of the thick film circuit diaphragms; printing the plurality of E-material blocks for joining on shared corresponding points of the thick film circuit diaphragms; finally, laminating surfaces to be joined, of the thick film circuit diaphragms, putting into a sagger mold, and sintering for 20-30 minutes at 480-520 DEG C. The joining process is simple in preparation process and high in finished product rate.

Description

technical field [0001] The invention relates to the technical field of multilayer thick film circuits, in particular to a connection process of laminated multilayer thick film circuits. Background technique [0002] Thick-film circuits generally achieve high integration of the overall circuit through single-sided or double-sided multi-layer wiring on the substrate. This approach is effective for improving the integration of the overall circuit. However, the more wiring layers, the more prominent the corresponding technical defects. Each layer of wiring must go through the design of the conduction band scheme and the determination of the printing scheme of the mission circuit. The determination of the printing scheme of the mission circuit must serve as a link between the past and the future for the subsequent multi-layer wiring. Each layer of wiring must go through the steps of conductive tape printing, drying, sintering, insulating layer covering and pattern printing, dryi...

AI Technical Summary

Problems solved by technology

[0003] During the preparation process, each layer of wiring needs to go through two sintering and printing alignment. The more layers of wiring on each substrate, the more opportunities for sintering and alignment, which will cause the following problems: 1) Multiple alignment 2) Repeated high-temperature sintering requires highly stable conduction band material and insulating layer material; 3) Multiple alignment printing and sintering of conduction band and insulating material will inevitably lead to many special situations, and the positioning will appear material The number of stacked concave-convex surfaces will affect the accuracy and performance of the next layer of wiring; 4) The more wiring layers, the lower the yield and the higher the cost

[0004] Therefore, the special manufacturing process of thick film circuits leads to problems such as low design and production efficiency, high production difficulty, low yield rate, and high production cost in the production process.

If the sintering times of the single-layer conduction band and the insulating layer can be reduced, it is of great significance to solve the above technical problems, but there is currently no effective solution