Joining process of laminated multi-layer thick film circuit

A thick film circuit and process technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of difficult production, high production cost, multiple alignment deviations, etc.

Active Publication Date: 2016-12-21
ZHUHAI HUAJING MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the preparation process, each layer of wiring needs to go through two sintering and printing alignment. The more layers of wiring on each substrate, the more opportunities for sintering and alignment, which will cause the following problems: 1) Multiple alignment 2) Repeated high-temperature sintering requires highly stable conduction band material and insulating layer material; 3) Multiple alignment printing and sintering of conduction band and insulating material will inevitably lead to many special situations, and the positioning will appear material The number of stacked conca

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0213] The invention relates to a connection process of laminated multi-layer thick-film circuits, which connects thick-film circuit diaphragms that have completed multi-layer wiring, hole metallization, and completed the production and adjustment of thick-film components. The specific connection process is:

[0214] Print S protective glaze on the surface to be connected of each thick film circuit diaphragm;

[0215] Then print a plurality of E material block connections on the common corresponding points between the thick film circuit diaphragms;

[0216] Finally, the surfaces to be joined of the thick-film circuit diaphragms are stacked together and placed in a sagger mold, and sintered at 480-520° C. for 20-30 minutes.

[0217] The method of the present invention is suitable for the connection of two thick-film circuit diaphragms, and is also suitable for the connection of three or other numbers.

[0218] Taking the connection of two pieces as an example, the specific pr...

Embodiment 2

[0272]The invention provides a connection process of laminated multi-layer thick-film circuits, which is used to connect the thick-film circuit diaphragms that have completed multi-layer wiring, hole metallization, and completed the production and adjustment of thick-film components. The specific connection process is:

[0273] Print low-temperature silver paste F conduction band points or conduction band lines or conduction band blocks on the conduction band connection points designed for each thick film circuit diaphragm that needs to be electrically connected;

[0274] Then print S protective glaze on the surface to be connected of each thick film circuit diaphragm;

[0275] Then print a plurality of E material block connections on the common corresponding points between the thick film circuit diaphragms;

[0276] Finally, the surfaces to be joined of the thick-film circuit diaphragms are stacked together and placed in a sagger mold, and sintered at 480-520° C. for 20-30 m...

Embodiment 3

[0347] A connection process for laminated multilayer thick film circuits, other features are the same as those in Embodiment 1 or 2, the difference is that:

[0348] According to parts by weight, the S protective glaze contains the raw materials of the following parts:

[0349] A: 55-82;

[0350] B:12-45;

[0351] C: 35-46; or

[0352] A: 55-78;

[0353] B:22-45;

[0354] C: 35-45; or

[0355] A: 55-65;

[0356] B:35-45;

[0357] C: 35-45.

[0358] Specifically, A contains the following raw materials:

[0359] SiO 2 :48;

[0360] TiO 2 :2;

[0361] ZnO: 4;

[0362] KF: 12;

[0363] Dehydrated Borax: 12. The softening temperature of component A is 480 degrees Celsius. or

[0364] SiO 2 :46;

[0365] TiO 2 :2;

[0366] ZnO: 5;

[0367] KF: 16;

[0368] Dehydrated Borax: 10. The softening temperature of component A is 500 degrees Celsius. or

[0369] SiO 2 :46;

[0370] TiO 2 :2;

[0371] ZnO: 6;

[0372] KF: 15;

[0373] Dehydrated borax: 11; the so...

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Abstract

The invention discloses a joining process and preparation method of a laminated multi-layer thick film circuit. The jointing process comprises the following steps: printing S protective glaze materials on the surfaces of thick film circuit diaphragms to be joined; printing a plurality of E-material blocks for joining on shared corresponding points of the thick film circuit diaphragms; finally, laminating surfaces to be joined, of the thick film circuit diaphragms, putting into a sagger mold, and sintering for 20-30 minutes at 480-520 DEG C; or the joining process comprises the following steps: printing low-temperature sliver slurry F on thick film circuit diaphragms to be electrically joined; printing the S protective glaze materials on the surfaces of the thick film circuit diaphragms; printing the plurality of E-material blocks for joining on shared corresponding points of the thick film circuit diaphragms; finally, laminating surfaces to be joined, of the thick film circuit diaphragms, putting into a sagger mold, and sintering for 20-30 minutes at 480-520 DEG C. The joining process is simple in preparation process and high in finished product rate.

Description

technical field [0001] The invention relates to the technical field of multilayer thick film circuits, in particular to a connection process of laminated multilayer thick film circuits. Background technique [0002] Thick-film circuits generally achieve high integration of the overall circuit through single-sided or double-sided multi-layer wiring on the substrate. This approach is effective for improving the integration of the overall circuit. However, the more wiring layers, the more prominent the corresponding technical defects. Each layer of wiring must go through the design of the conduction band scheme and the determination of the printing scheme of the mission circuit. The determination of the printing scheme of the mission circuit must serve as a link between the past and the future for the subsequent multi-layer wiring. Each layer of wiring must go through the steps of conductive tape printing, drying, sintering, insulating layer covering and pattern printing, dryi...

Claims

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Application Information

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IPC IPC(8): H01L21/70H01L21/60H01L21/56
CPCH01L21/561H01L21/705H01L24/81H01L2224/81051H01L2224/8184
Inventor 郑锦清任春祥
Owner ZHUHAI HUAJING MICROELECTRONICS
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