The invention discloses a
single crystal copper bonding lead and a preparation method thereof, relating to the field of production of microelectronic materials. The production technology integrates a
metal material preparation process, a heat treatment process and
a diamond die process, ensures the production consistency and reliability and realizes the large-scale production. The adopted production process comprises the steps of providing die repair and
gas protection equipment,
smelting, wiredrawing, cleaning, and compounding, packaging and testing a finished product. The
single crystal copper bonding lead has the beneficial effects that as a
signal crystal copper material has a compact solidification structure, lateral
crystal boundaries are eliminated, the
casting defects of shrinkage cavities, pores and the like are avoided, the plastic working performance, the mechanical performance, the electric performance and the like of the
signal crystal copper material are obviously higher than those of the conventional
oxygen-free copper, the defects of more end breakage, low quality and low productivity in the wiredrawing process of the conventional
copper wire are overcome, and an
electronic packaging bonding wire with the wire
diameter reaching 0.015m, high strength, high elongation and stable performance can be prepared.