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225 results about "E-Material" patented technology

E-Material, also called E Material, is a metal matrix composite consisting of beryllium matrix with beryllium oxide particles. It has high thermal conductivity (210-230 W/m K), and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips and various ceramics. It is chiefly used in microelectronics as substrate for power semiconductor devices and high density multi-chip modules, where it aids with removal of waste heat. E-materials have low weight and high strength, making them especially suitable for aerospace technology. Their high elastic modulus is favorable for absorbing vibrations and lowering material fatigue of attached modules and wire bonds.

Preparation method of flexible copper electrode pattern in micron level wire width

The invention belongs to the field of microelectronic material, and relates to a preparation method of a flexible copper electrode pattern in a micron level wire width. The preparation method provided by the invention is a ''whole addition'' method, which means that metal copper only precipitates on a predetermined position on a plastic substrate. A specific process comprises steps of plastic substrate cleaning, drying, surface modification, ultraviolet irradiation under a photomask and chemical coppering, etc. The flexible copper electrode pattern prepared by the invention has the following advantages that (1) precision of the electrode pattern is determined by the photomask to reach a micron level wire width; (2) most of the process is carried out in solution, so the process does not require large-scale apparatus equipment and rigorous environment of anultraclean chamber and is suitable for low cost and large scale production; (3) the electrode pattern and the plastic substrate are firmly bonded, can stand repeat folding and have long service life and high reliability; (4) the electrode pattern has good conductivity and is beneficial for reducing energy consumption during usage. The flexible copper electrode pattern prepared by the invention can be widely applied to industrial fields of flexible transistor, flexible solar cell and flexible luminescent device, etc.
Owner:FUDAN UNIV

Method for preparing flexible polyester nickel-coating electrode

The invention belongs to the technical field of electric materials and devices, and relates to a method for preparing a flexible polyester nickel-coating electrode. The method particularly comprises the following steps of: performing surface silicification modification on a polyester substrate, and introducing silane coupler molecules, of which the tail ends contain active groups such as sulfhydryl groups, amino groups and acylamino groups on the premise of not damaging surface flatness; performing catalytic activation on the polyester substrate in mixed solution of silver nitrate and glucose so as to make a thin layer of silver catalyst coated on the polyester substrate undergoing silicification, wherein the silver catalyst layer and the substrate are connected by chemical bonds; and finally performing chemical nickel-plating in the presence of silver catalyst. The polyester nickel-coating electrode prepared by the method has the advantages of strong adhesion between the nickel coating layer and the substrate, stripping strength of more than 40N/cm, high smoothness, root-mean-square roughness(Rrms) of less than 15nm (the area is 5mu m*5mu m), high electric conductivity, and lower resistivity (5.3 mu omega.cm) compared with that of pure nickel. The flexible polyester nickel-coating electrode can be widely applied to solar batteries, membrane ion secondary batteries, flexible organic electric devices, and the like.
Owner:FUDAN UNIV

Thick film pyroelectric sensitive element and preparation method thereof

The invention belongs to the technical field of electronic materials and components, and particularly relates to a thick film pyroelectric sensitive element and a preparation method thereof. The thick film pyroelectric infrared sensitive element comprises a top electrode, a heat sensitive layer and a bottom electrode. The top electrode is used as a common electrode, and the thickness of the infrared radiation absorbing surface of the top electrode is 10-500 nm. The heat sensitive layer is arranged between the top electrode and the bottom electrode and is prepared by compounding pyroelectric ceramic powder and organic pyroelectric polymers, and the thickness of the heat sensitive layer is 1-100 um. The bottom electrode is used for leading out pyroelectric response signals, and the thickness of the bottom electrode is 10 nm to 1 um. According to different types of pyroelectric infrared sensitive element, the top electrode and the bottom electrode of the infrared sensitive element are imaged. The thick film pyroelectric sensitive element is applied to safety burglary prevention, human body detection and the like in the civilian field. The thick film pyroelectric sensitive element has the advantages of being good in thermal insulation effect, more sensitive to weak environment temperature change, higher in sensitivity, simple in manufacturing technology, low in cost, capable of facilitating batch processing and beneficial to industrialization production.
Owner:UNIV OF ELECTRONIC SCI & TECH OF CHINA

Preparation method for perovskite type solar battery

The invention discloses a preparation method for a perovskite type solar battery, and belongs to the field of optoelectronic materials and devices. The perovskite type solar battery comprises a transparent conducting substrate, a TiO2 electron transporting layer, a perovskite light-absorbing layer, a hole transmission layer and a metal counter electrode layer that are stacked in sequence, wherein the preparation for the electronic transporting layer comprises the steps of step a, providing a transparent substrate material with a clean surface, and depositing a titanium dioxide compact thin film on the surface of the substrate material by adopting an atomic layer depositing technology; step b, depositing a titanium-contained organic-inorganic composite film on the titanium dioxide compact thin film obtained in the step a by adopting a molecular layer depositing technology; and step c, annealing the material obtained in the step b at the temperature of 400-600 DEG C for 0.5-5 hours to obtain the TiO2 electron transporting layer. The TiO2 electron transporting layer provided by the invention is higher in the degree of crystallinity, uniform in film formation and lower in impedance, so that the photo-generated current density is dramatically increased, and the photoelectric converting efficiency and the thermal stability of the devices are greatly improved.
Owner:HUBEI UNIV

PZT (lead zirconate titanate)-based antiferroelectric ceramic material with low curie point and high bidirectional-adjustable dielectric electric field and preparation method thereof

InactiveCN102643090AHigh dielectric constantHigh pyroelectric responseLead zirconate titanateElectron
The invention relates to a PZT (lead zirconate titanate)-based antiferroelectric ceramic material with low curie point TC and a high bidirectional-adjustable dielectric electric field and a preparation method thereof and belongs to the technical fields of electronic materials and devices. The chemical general formula of the PZT-based antiferroelectric ceramic material with bidirectional adjustability of a dielectric electric field is (Pb[0.99-x-y]BaxLay)(Zr0.51Sn 0.39Ti0.10)O3, wherein x is larger than 0 and less than or equal to 0.20, and y is larger than 0 and less than or equal to 0.06. The PZT-based antiferroelectric ceramic material with dielectric bidirectional adjustability has high dielectric coefficient and low dielectric loss under a certain bias voltage in the vicinity of low curie point TC, and the dielectric coefficient is increased and then decreased along with the increase of the bias voltage; the PZT-based antiferroelectric ceramic material has bidirectional dielectric adjustability, simultaneously has high pyroelectric coefficient and pyroelectric current, and can be widely used in the fields of microelectronics, computers, capacitors, sensors, aerospace technologies and the like.
Owner:TONGJI UNIV

Single crystal copper bonding lead and preparation method thereof

The invention discloses a single crystal copper bonding lead and a preparation method thereof, relating to the field of production of microelectronic materials. The production technology integrates a metal material preparation process, a heat treatment process and a diamond die process, ensures the production consistency and reliability and realizes the large-scale production. The adopted production process comprises the steps of providing die repair and gas protection equipment, smelting, wiredrawing, cleaning, and compounding, packaging and testing a finished product. The single crystal copper bonding lead has the beneficial effects that as a signal crystal copper material has a compact solidification structure, lateral crystal boundaries are eliminated, the casting defects of shrinkage cavities, pores and the like are avoided, the plastic working performance, the mechanical performance, the electric performance and the like of the signal crystal copper material are obviously higher than those of the conventional oxygen-free copper, the defects of more end breakage, low quality and low productivity in the wiredrawing process of the conventional copper wire are overcome, and an electronic packaging bonding wire with the wire diameter reaching 0.015m, high strength, high elongation and stable performance can be prepared.
Owner:宋东升
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