Method for preparing flexible polyester nickel-coating electrode

Abstract

The invention belongs to the technical field of electric materials and devices, and relates to a method for preparing a flexible polyester nickel-coating electrode. The method particularly comprises the following steps of: performing surface silicification modification on a polyester substrate, and introducing silane coupler molecules, of which the tail ends contain active groups such as sulfhydryl groups, amino groups and acylamino groups on the premise of not damaging surface flatness; performing catalytic activation on the polyester substrate in mixed solution of silver nitrate and glucose so as to make a thin layer of silver catalyst coated on the polyester substrate undergoing silicification, wherein the silver catalyst layer and the substrate are connected by chemical bonds; and finally performing chemical nickel-plating in the presence of silver catalyst. The polyester nickel-coating electrode prepared by the method has the advantages of strong adhesion between the nickel coating layer and the substrate, stripping strength of more than 40N / cm, high smoothness, root-mean-square roughness(Rrms) of less than 15nm (the area is 5mu m*5mu m), high electric conductivity, and lower resistivity (5.3 mu omega.cm) compared with that of pure nickel. The flexible polyester nickel-coating electrode can be widely applied to solar batteries, membrane ion secondary batteries, flexible organic electric devices, and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and devices, and in particular relates to a preparation method of a flexible polyester nickel-coated electrode. Background technique [0002] Flexible electronic materials and devices are new growth points for the development of the information industry. Flexible displays, flexible organic light-emitting diodes, flexible organic solar cells, electronic sensing skins, and flexible memories are replacing traditional silicon-based electronic devices and entering public life (Lu Yinxiang et al. .Introduction to Modern Information Materials, East China University of Science and Technology Press, 2008). [0003] In the manufacturing process of flexible electronic devices, flexible electrodes are involved, which are used to connect with external circuits; the preparation method of flexible electrodes is usually to cover a layer of metal plating on the flexible substrate. The techniques used...

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Problems solved by technology

For the preparation of polyester nickel-clad electrodes for flexible electronic devices, the above-mentioned process has the following disadvantages: (1) etching makes the surface of the polyester substrate rough and reduces the mechanical strength of the substrate; generally speaking, the polyester substrate shows There are no active groups, the surface free energy is low, and the amount of palladium catalyst adsorbed is small. The quality of the coating obtained in this way is not high. The etching process can alleviate the above shortcomings to a certain extent, but the process itself inevitably causes uneven substrates. The consequence is that the surface of the obtained coating is also uneven, which is a fatal shortcoming for flexible electronic devices

(2) On the substrate surface after etching, after electroless plating, there is always physical adsorption between the nickel metal coating and the substrate, the adsorption force between the coating and the substrate is relatively small, and the coating is easy to fall off, which reduces the reliability and service life of flexible electronic devices shorten

(3) Sodium hydrogen phosphite is used as a reducing agent, and the obtained nickel coating is a nickel-phosphorus alloy. Compared with pure nickel, its conductivity drops by an order of magnitude, which will inevitably cause an increase in power consumption of flexible electronic devices and reduce product quality.

(4) Palladium is a precious metal. In recent years, the price has been rising all the way, which makes the production cost of flexible devices continue to increase; and a small amount of palladium catalyst falls off in the chemical plating solution, which will cause the decomposition of the plating solution and reduce the use efficiency of the plating solution.

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