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Polyimide and coating composition formed thereby

一种聚酰亚胺、组合物的技术，应用在软性组件领域，能够解决易黄变、变脆、材料特性与操作性冲突等问题，达到不易黄变、优异耐化性与热性质、透明性佳的效果

Active Publication Date: 2013-09-25
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Although the above-mentioned soluble polyimide has good heating reactivity, due to its own structural problems (with triple bonds and N=C=O groups), it will also form a rigid structure and become brittle and easy to yellow when it is thermally cured, resulting in trust. sexual problems
[0015] Because there is often a conflict between material properties and operability, those engaged in polyimide research have always been unable to balance

Method used

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  • Polyimide and coating composition formed thereby
  • Polyimide and coating composition formed thereby
  • Polyimide and coating composition formed thereby

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0098] In the following examples, the abbreviations used are defined as follows:

[0099] 6FDA: 4,4'-hexafluoroisopropylidene-2,2-bis(phthalic anhydride) (4,4'-hexafluoroisopropylidene-2,2-bis-(phthalic acid anhydride)

[0100] S-BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-Biphenyltetracarboxylic dianhydride)

[0101] CBDA: 1,2,3,4-cyclobutanetetracarboxylic dianhydride (1,2,3,4-cyclobutanetetracarboxylic dianhydride)

[0102] BPAF: 5,5'-(9H-fluorene-9,9-diyl)diisobenzofuran-1,3-dione (5,5'-(9H-fluorene-9,9-diyl)diisobenzofuran- 1,3-dione)

[0103] TFMB: 2,2'-bis(trifluoromethyl)-p-diaminobiphenyl (2,2'-bis(trifluoromethyl)benzidine)

[0104] CHDA: 1,4-diaminocyclohexane (1,4-diaminocyclohexane)

[0105] BAFL: 4-(9-(4-aminophenyl)-9H-fluoren-9-yl)aniline (4-(9-(4-aminophenyl)-9H-fluoren-9-yl)benzonamine)

[0106] TMDA: 1-(4-aminophenyl)-2,3-dihydro-1,3,3-trimethyl-1 hydrogen-indene-5-amine (1-(4-aminophenyl)-2,3- dihydro-1,3,3-trimethyl-1H-inden-5-amin...

Embodiment A-1

[0115] Embodiment A-1: ​​synthesis has the polyimide (PI-A1) of tetraacid terminal group

[0116]Weigh 97.7328g (0.22mol) of 6FDA and 64.046g (0.2mol) of TFMB, add 640mL of NMP, stir at room temperature for 1 hour, then raise the temperature to 60°C and stir for 4 hours. After 4 hours, 320 mL of xylene was added, and water was removed with a dean-stark apparatus at 180°C. After the water removal is complete, the solution is lowered to room temperature, and then 0.7208 g (0.04 mol) of H 2 O. After the addition was complete, the solution was warmed to 80°C and stirred for 4 hours. You can get PI-A1.

Embodiment A-2

[0117] Embodiment A-2: synthesis has the polyimide (PI-A2) of tetraacid terminal group

[0118] Weigh 43.1442g (0.22mol) of CBDA and 64.046g (0.2mol) of TFMB, add 640mL of NMP, stir at room temperature for 1 hour, then raise the temperature to 60°C and stir for 4 hours. After 4 hours, 320 mL of xylene was added, and water was removed with a dean-stark apparatus at 180°C. After the water removal is complete, the solution is lowered to room temperature, and then 0.7208 g (0.04 mol) of H 2 O. After the addition was complete, the solution was warmed to 80°C and stirred for 4 hours. You can get PI-A2.

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Abstract

The present invention relates to a polyimide and a coating composition formed thereby, wherein the polyimide is represented by a formula (1), two ends of the polyimide respectively have two -COOH capping groups. The coating composition of the present invention comprises the polyimide and a hardener having two to six functional groups which can be reacted with the -COOH. A polyimide coating and a polyimide film formed by the coating composition of the present invention have excellent solution resistance and coefficient of thermal expansion (CTE), and can be applied to active (passive) assembly, optical materials, touch panels, copper clad laminates, flexible electronic materials, or protection materials of integrated circuit modules, or thin film base materials of glass thin film touch panels.

Description

technical field [0001] The invention relates to a polyimide with two -COOH end groups at both ends, a coating composition formed from the polyimide, and a soft component using the coating composition. Background technique [0002] Polyimide (PI) refers to the compound with following formula functional group: [0003] [0004] Because polyimide has excellent thermal stability, and the films formed by it usually have good mechanical, electrical and chemical properties, polyimide has always been the first choice for high-performance polymer materials. [0005] In the semiconductor industry, polyimide is widely used in passivation film, stress buffer film, alpha particle shielding film, dry etching protective cover, micro-electromechanical and interlayer insulating film, etc. It can also be applied to various electronic structures, enameled wires, printed circuit boards, sensing components, and separation membranes. In addition, polyimide can also be used for active (passiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08G73/12C09D179/08
CPCC09D179/08C08G73/10C08G73/1039C08G73/106
Inventor 周孟彦吴仲仁
Owner ETERNAL MATERIALS CO LTD
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